US4897118A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein
Assignee: MacDermid Acumen Inc
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Filing: 1987-11-10
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Granted: 1990-01-30
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Expires: 2007-11-10
Abstract
Abstract A process for selective metallization of a substrate in a predetermined desired pattern, and particularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.
Inventors
- 👤 Donald R. Ferrier
- 👤 Gary B. Larson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:29
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/40; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1651; C23C18/1653; C23C18/18; C23C18/20; C23C18/28; C23C18/285; C23C18/30; C23C18/31; C23C18/38; C23C18/40; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0706; H05K2203/0779; H05K2203/0786; H05K2203/0793; H05K2203/14; H05K2203/1415; H05K3/38; H05K3/389; H05K3/40; H05K3/42; H05K3/425; H05K3/426
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
110 words
A composition for use in treating a substrate surface which has been masked in a predetermined pattern with an organic plating resist material such that upon subsequent treatment of the substrate surface with an activating solution and a metal plating solution, metal plating on unmasked surfaces is enhanced while metal plating on said resist is minimized, said composition consisting essentially of an aqueous solution containing (i) an organosilane conditioning agent, present in an amount of from about 0.1 to 8 g/l, and (ii) an adjuvant, selected from the group consisting of ethylenediamine, N,N,N',N'-tetramethyl-1,3-butanediamine, diethylene diamine, triethylene tetraamine, and mixtures thereof, in an amount of from about 5 to 15 g/l.
Claim 2
Dependent Claim
110 words
A composition for use in treating a substrate surface which has been masked in a predetermined pattern with an organic plating resist material such that upon subsequent treatment of the substrate surface with an activating solution and a metal plating solution, metal plating on unmasked surfaces is enhanced while metal plating on said resist is minimized, said composition consisting essentially of an aqueous solution containing (i) an organosilane conditioning agent, present in an amount of from about 0.1 to 8 g/l, and (ii) an adjuvant, selected from the group consisting of ethylenediamine, N,N,N',N'-tetramethyl-1,3-butanediamine, diethylene diamine, triethylene tetraamine, and mixtures thereof, in an amount of from about 5 to 15 g/l.
Claim 3
Dependent Claim
11 words
The composition according to claim 1 wherein said adjuvant is ethylenediamine.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-29 | 1993-07-31 | 1994-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-29 | 1997-07-31 | 1998-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-29 | 2001-07-31 | 2002-01-30 | $7700.00 | Window Closed / Lapsed |