US5004525A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper electroplating composition
Assignee: Shipley Co Inc
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Filing: 1989-11-20
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Granted: 1991-04-02
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Expires: 2009-11-20
Abstract
Abstract A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
Inventors
- 👤 Roger F. Bernards
- 👤 Gordon Fisher
- 👤 Wade Sonnenberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:49
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38; H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K2203/00; H05K2203/16; H05K2203/162
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
88 words
An aqueous acid copper plating solution comprising one or more bath soluble copper salts in a concentration sufficient to provide a total copper ion content in an amount varying between 1 and 10 grams per liter and sufficient to support plating, acid as an electrolyte and a surfactant conforming to the formula R--O--(CH.sub.2 CH.sub.2 O).sub.n H where R is an aryl or alkyl group containing from about 2 to 20 carbon atoms and n is an integer whereby the molecular weight of the surfactant is at least 500,000.
Claim 2
Dependent Claim
88 words
An aqueous acid copper plating solution comprising one or more bath soluble copper salts in a concentration sufficient to provide a total copper ion content in an amount varying between 1 and 10 grams per liter and sufficient to support plating, acid as an electrolyte and a surfactant conforming to the formula R--O--(CH.sub.2 CH.sub.2 O).sub.n H where R is an aryl or alkyl group containing from about 2 to 20 carbon atoms and n is an integer whereby the molecular weight of the surfactant is at least 500,000.
Claim 3
Dependent Claim
20 words
The copper plating solution of claim 1 where the copper salt is cupric sulfate and the acid is sulfuric acid.
Claim 4
Dependent Claim
11 words
The copper plating solution of claim 1 where R is ethylene.
Claim 5
Dependent Claim
18 words
The copper plating solution of claim 1 where the molecular weight of the surfactant is at least 2,500,000.
References Cited (Backward Citations)
US2931760A
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US3328273A
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US3770598A
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US4374709A
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US4384930A
Cited
GB2123036A
Cited
US4555315A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-01 | 1994-10-01 | 1995-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-01 | 1998-10-01 | 1999-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-01 | 2002-10-01 | 2003-04-02 | $7700.00 | Window Closed / Lapsed |