US5147208A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible printed circuit with raised contacts
Assignee: ADFlex Solutions Inc
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Filing: 1991-06-28
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Granted: 1992-09-15
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Expires: 2011-06-28
Abstract
Abstract A flexible printed circuit with raised contacts is presented. In accordance with this invention, a flexible circuit is disposed on a substrate. The substrate includes a pattern comprised of a plurality of raised features. Similarly, the flexible circuit has a corresponding pattern comprised of a plurality of contact pads. The contact pads are disposed on the raised features to form the raised contacts. The raised contacts perfect registration between the contact pads and the contact surfaces of a mating electrical component (e.g., a surface mount integrated circuit) when a pressure connection system is employed.
Inventors
- 👤 Gary A. Bachler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:26
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/61; H05; H05K; H05K3/00; H05K3/0011; H05K3/0014; H05K3/40; H05K3/4007; H01R12/70; H01R12/71; H01R12/712; H01R12/714; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09009; H05K2201/091; H05K2201/09118; H05K3/0058; H05K3/0064; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
57 words
A raised contact pad, comprising: an electrically non-conductive generally planar rigid substrate having a non-deformable raised portion extending therefrom; and flexible circuit means having a contact pad, said flexible circuit means being disposed on said substrate with said contact pad being disposed over said non-deformable raised portion thereby defining a raised contact pad supported by said substrate.
Claim 2
Dependent Claim
57 words
A raised contact pad, comprising: an electrically non-conductive generally planar rigid substrate having a non-deformable raised portion extending therefrom; and flexible circuit means having a contact pad, said flexible circuit means being disposed on said substrate with said contact pad being disposed over said non-deformable raised portion thereby defining a raised contact pad supported by said substrate.
Claim 3
Dependent Claim
15 words
The raised contact pad of claim 1 wherein said substrate comprises a molded plastic substrate.
Claim 4
Dependent Claim
18 words
The raised contact pad of claim 1 wherein said contact pad is continuous with said flexible circuit means.
Claim 5
Dependent Claim
60 words
The raised contact pad of claim 1 wherein said flexible circuit means comprises: a base layer deposited on said substrate; an electrically conductive layer deposited on said base layer; and a cover layer deposited on portions of said conductive layer so that at least a portion of said conductive layer is sandwiched between said base layer and said cover layer.
Claim 6
Dependent Claim
13 words
The raised contact pad of claim 4 wherein said conductive layer comprises copper.
Claim 7
Dependent Claim
20 words
The raised contact pad of claim 4 wherein said base layer and said cover layer comprises an electrically non-conductive film.
Claim 8
Dependent Claim
16 words
The raised contact pad of claim 6 wherein said electrically non-conductive film is a polyimide film.
Claim 9
Dependent Claim
69 words
A circuit board, comprising: an electrically non-conductive generally planar rigid substrate having a first pattern which comprises at least one non-deformable raised portion extending therefrom; and flexible circuit means having a second pattern which comprises at least one contact pad, said flexible circuit being disposed on said substrate with said second pattern corresponding to said first pattern thereby defining at least one raised contact pad supported by said substrate.
Claim 10
Dependent Claim
69 words
A circuit board, comprising: an electrically non-conductive generally planar rigid substrate having a first pattern which comprises at least one non-deformable raised portion extending therefrom; and flexible circuit means having a second pattern which comprises at least one contact pad, said flexible circuit being disposed on said substrate with said second pattern corresponding to said first pattern thereby defining at least one raised contact pad supported by said substrate.
Claim 11
Dependent Claim
14 words
The circuit board of claim 8 wherein said substrate comprises a molded plastic substrate.
Claim 12
Dependent Claim
29 words
The circuit board of claim 8 wherein: said substrate includes a plurality of said raised portions; and said flexible circuit means includes a corresponding plurality of said contact pads.
Claim 13
Dependent Claim
18 words
The raised contact pad of claim 8 wherein said contact pad is continuous with said flexible circuit means.
Claim 14
Dependent Claim
59 words
The circuit board of claim 8 wherein said flexible circuit means comprises: a base layer deposited on said substrate; an electrically conductive layer deposited on said base layer; and a cover layer deposited on portions of said conductive layer so that at least a portion of said conductive layer is sandwiched between said base layer and said cover layer.
Claim 15
Dependent Claim
12 words
The circuit board of claim 12 wherein said conductive layer comprises copper.
Claim 16
Dependent Claim
19 words
The circuit board of claim 12 wherein said base layer and said cover layer comprises an electrically non-conductive film.
Claim 17
Dependent Claim
15 words
The circuit board of claim 14 wherein said electrically non-conductive film is a polyimide film.
Claim 18
Independent Claim
76 words
A method for forming a circuit board having at least one raised contact pad thereon, comprising the steps of: molding a substrate to provide a generally planar rigid surface having at least one non-deformable raised portion extending therefrom; and pressing a flexible circuit against said substrate so that at least one contact pad of said flexible circuit is formed over said non-deformable raised portion thereby defining at least one raised contact pad supported by said substrate.
Claim 19
Independent Claim
76 words
A method for forming a circuit board having at least one raised contact pad thereon, comprising the steps of: molding a substrate to provide a generally planar rigid surface having at least one non-deformable raised portion extending therefrom; and pressing a flexible circuit against said substrate so that at least one contact pad of said flexible circuit is formed over said non-deformable raised portion thereby defining at least one raised contact pad supported by said substrate.
Claim 20
Dependent Claim
18 words
The method of claim 16 wherein said pressing further comprises pressing said flexible circuit under heat and pressure.
Claim 21
Dependent Claim
11 words
The method of claim 16 wherein said substrate comprises molded plastic.
Claim 22
Dependent Claim
58 words
The method of claim 16 wherein said flexible circuit means comprises: a base layer deposited on said substrate; en electrically conductive layer deposited on said base layer; and a cover layer deposited on portions of said conductive layer so that at least a portion of said conductive layer is sandwiched between said base layer and said cover layer.
Claim 23
Dependent Claim
11 words
The method of claim 19 wherein said conductive layer comprises copper.
Claim 24
Dependent Claim
18 words
The method of claim 19 wherein said base layer and said cover layer comprises an electrically non-conductive film.
Claim 25
Dependent Claim
14 words
The method of claim 21 wherein said electrically non-conductive film is a polyimide film.
References Cited (Backward Citations)
US4548451A
Cited
US5095628A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-15 | 1996-03-16 | 1996-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-15 | 2000-03-16 | 2000-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-15 | 2004-03-16 | 2004-09-15 | $7700.00 | Window Closed / Lapsed |