Process for selectively etching diamond

Claim 2

A process for selectively etching a diamond substrate comprising the steps of: (a) forming one or more graphitic areas within a diamond substrate by implanting the diamond substrate with ions capable of graphitizing diamond to a depth below the surface of the diamond substrate and (b) selectively etching the diamond substrate with a gaseous reactant under conditions sufficient to convert the graphitic area to a gaseous product.

Claim 3

The process according to claim 1 wherein the conditions sufficient to convert the graphitic area to a gaseous product include substantially avoiding reacting with the diamond of the diamond substrate.

Claim 4

The process according to claim 1 wherein the ions are carbon ions.

Claim 5

The process according to claim 1 wherein the step of forming one or more graphitic areas of step (a) includes annealing the diamond substrate at a temperature of about 500° C. to 650° C. for about 10 minutes to 1.5 hours.

Claim 6

The process according to claim 1 wherein the ions are oxygen ions.

Claim 7

The process according to claim 1 wherein the implanting of ions comprises ion implantation at a dose of about 1×10 16 to 1×10 18 ions cm 2 and an energy of about 1 to 5 MeV.

Claim 8

The process according to claim 1 wherein the gaseous reactant is molecular oxygen.

Claim 9

A process according to claim 1 wherein the substrate is two or more single crystal diamond substrates placed in contacting relationship with each other with the crystal directions thereof aligned substantially the same.

Claim 10

A process according to claim 1 wherein the diamond substrate is formed from diamond selected from the group consisting of natural single crystal diamond, synthetic single crystal diamond, homoepitaxial diamond, heteroepitaxial diamond and polycrystalline diamond.

Claim 11

A process according to claim 1 wherein the implanting of the diamond substrate with ions is patterned.

Claim 12

A process for selectively etching a single crystal diamond substrate comprising the steps of: (a) implanting a single crystal diamond layer with ions to a depth within the single crystal diamond substrate to form one or more graphitic areas below the surface of the diamond layer and (b) selectively etching the diamond substrate with molecular oxygen under conditions sufficient to oxidize the graphitic area while substantially avoiding reacting with the diamond of the single crystal diamond substrate.

Claim 13

A process for selectively etching a single crystal diamond substrate comprising the steps of: (a) implanting a single crystal diamond layer with ions to a depth within the single crystal diamond substrate to form one or more graphitic areas below the surface of the diamond layer and (b) selectively etching the diamond substrate with molecular oxygen under conditions sufficient to oxidize the graphitic area while substantially avoiding reacting with the diamond of the single crystal diamond substrate.

Claim 14

The process according to claim 11 wherein the ions are carbon ions.

Claim 15

The process according to claim 12 wherein the step of forming a graphitic area includes annealing the single crystal diamond substrate at a temperature of about 500° C. to 650° C. for about 10 minutes to 1.5 hours.

Claim 16

The process according to claim 11 wherein the ions are oxygen ions.

Claim 17

The process according to claim 11 wherein the implanting of ions comprises ion implantation at a dose of about 1×10 16 to 1×10 18 ions cm 2 and an energy of about 1 to 5 MeV.

Claim 18

A process according to claim 11 wherein the substrate is two or more single crystal diamond substrates placed in contacting relationship with each other with the crystal directions thereof aligned substantially the same.

Claim 19

A process according to claim 11 wherein the single crystal diamond substrate includes a homoepitaxial diamond film deposited thereon.

Claim 20

A process for forming a diamond layer having a thickness comprising the steps of: (a) forming a graphitic layer within a diamond substrate at a depth below the surface thereof, the graphitic layer dividing the diamond substrate into an upper portion above the graphitic layer and a lower portion beneath the graphitic layer; (b) selectively etching the diamond substrate with a gaseous reactant under conditions sufficient to convert the graphitic layer to a gaseous product and to form an interface between the upper and lower portions of the diamond substrate substantially avoiding reacting with the diamond of the upper and lower portions of the diamond substrate; and (c) lifting off the upper portion of the diamond substrate from the lower portion of the diamond substrate at the interface to provide a diamond layer having a thickness substantially equal to the depth of the interface.

Claim 21

A process for forming a diamond layer having a thickness comprising the steps of: (a) forming a graphitic layer within a diamond substrate at a depth below the surface thereof, the graphitic layer dividing the diamond substrate into an upper portion above the graphitic layer and a lower portion beneath the graphitic layer; (b) selectively etching the diamond substrate with a gaseous reactant under conditions sufficient to convert the graphitic layer to a gaseous product and to form an interface between the upper and lower portions of the diamond substrate substantially avoiding reacting with the diamond of the upper and lower portions of the diamond substrate; and (c) lifting off the upper portion of the diamond substrate from the lower portion of the diamond substrate at the interface to provide a diamond layer having a thickness substantially equal to the depth of the interface.

Claim 22

The process according to claim 18 wherein the step of forming a graphitic area includes implanting the diamond substrate with ions capable of graphitizing diamond to a depth within the diamond substrate to form the graphitic layer at the depth.

Claim 23

The process according to claim 18 wherein the conditions sufficient to convert the graphitic layer to a gaseous product includes substantially avoiding reacting with the diamond of the upper and lower portions of the diamond substrate.

Claim 24

The process according to claim 18 wherein step (b) and step (c) are substantially simultaneous.

Claim 25

A process according to claim 19 wherein the implanting of the diamond substrate with ions is patterned.

Claim 26

The process according to claim 19 wherein the ions are carbon ions.

Claim 27

The process according to claim 23 wherein the step of forming a graphitic area includes annealing the diamond substrate at a temperature of about 500° C. to 650° C. for about 10 minutes to 1.5 hours.

Claim 28

The process according to claim 19 wherein the ions are oxygen ions.

Claim 29

The process according to claim 19 wherein the implanting of ions comprises ion implantation at a dose of about 1×10 16 to 1×10 18 ions cm 2 and an energy of about 1 to 5 MeV.

Claim 30

The process according to claim 18 wherein the gaseous reactant is molecular oxygen.

Claim 31

A process according to claim 18 wherein the substrate is two or more single diamond substrates placed in contacting relationship with each other with the crystal directions thereof aligned substantially the same.

Claim 32

A process according to claim 18 wherein the diamond substrate is formed from diamond selected from the group consisting of natural single crystal diamond, synthetic single crystal diamond, homoepitaxial diamond, heteroepitaxial diamond and polycrystalline diamond.