Patent US5280850A successfully refreshed from Google Patents.
US5280850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing circuit board
Assignee: Toshiba Corp
•
Filing: 1992-10-16
•
Granted: 1994-01-25
•
Expires: 2012-10-16
Abstract
Abstract According to this invention, there is provided a method of manufacturing a highly reliable circuit board in which a copper member is strongly, directly bonded to a substrate made of an aluminum nitride sintered body, thereby obtaining high peel strength. The method of manufacturing the circuit board includes the steps of bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body, and heating the substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuporus oxide composition, and directly bonding the copper member to the substrate.
Inventors
- 👤 Akihiro Horiguchi
- 👤 Mitsuo Kasori
- 👤 Fumio Ueno
- 👤 Hiroshi Komorita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
134 words
A method of manufacturing a circuit board comprising the steps of: bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuporus oxide composition, and directly bonding said copper member to said substrate.
Claim 2
Independent Claim
134 words
A method of manufacturing a circuit board comprising the steps of: bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 μm formed on a surface of a substrate made of an aluminum nitride sintered body; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuporus oxide composition, and directly bonding said copper member to said substrate.
Claim 3
Dependent Claim
26 words
A method according to claim 1, wherein said substrate is made of aluminum nitride sintered body, and said oxide surface layer is formed on said substrate.
Claim 4
Dependent Claim
30 words
A method according to claim 1, wherein said substrate is made of aluminum oxide sintered body, and said oxide surface layer is made of aluminum oxide integral with said substrate.
Claim 5
Dependent Claim
15 words
A method according to claim 1, wherein said copper member contains 150-660 ppm of oxygen.
Claim 6
Dependent Claim
18 words
A method according to claim 1, wherein said inert gas atmosphere contains 1 to 50 ppm of oxygen.
Claim 7
Dependent Claim
24 words
A method according to claim 1, wherein copper is substantially exposed from a surface of said copper member which is bonded to said substrate.
Claim 8
Dependent Claim
26 words
A method according to claim 1, wherein a peel strength of said copper member which is bonded to said substrate is not less than 5 kgf/cm.
Claim 9
Independent Claim
136 words
A method of manufacturing a circuit board comprising the steps of: providing a substrate made of aluminum nitride sintered body or aluminum oxide sintered body, said substrate having an oxide surface layer; brining a copper member containing 100 to 1000 ppm of oxygen into contact with said oxide surface layer of said substrate; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypo-eutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuprous oxide composition, and directly bonding said member to said substrate.
Claim 10
Independent Claim
136 words
A method of manufacturing a circuit board comprising the steps of: providing a substrate made of aluminum nitride sintered body or aluminum oxide sintered body, said substrate having an oxide surface layer; brining a copper member containing 100 to 1000 ppm of oxygen into contact with said oxide surface layer of said substrate; and heating said substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypo-eutectic region of a two-component phase diagram of Cu-Cu 2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuprous oxide composition, and directly bonding said member to said substrate.
Claim 11
Dependent Claim
19 words
A method according to claim 8, wherein said oxide surface layer is formed by sol-gel method on said substrate.
Claim 12
Dependent Claim
19 words
A method according to claim 8, wherein said oxide surface layer is formed by alkoxy method on said substrate.
Claim 13
Dependent Claim
15 words
A method according to claim 8, wherein said aluminum nitride powder containing a sintering aid.
References Cited (Backward Citations)
GB761045A
Cited
US3744120A
Cited
US3766634A
Cited
US3994430A
Cited
US4129243A
Cited
US4505418A
Cited
JPS593077A
Cited
US4849292A
Cited
US4693409A
Cited
JPS59121172A
Cited
JPS59121890A
Cited
JPS604154A
Cited
JPS6032343A
Cited
US5176309A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-24 | 1997-07-26 | 1998-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-24 | 2001-07-26 | 2002-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-24 | 2005-07-26 | 2006-01-25 | $7700.00 | Window Closed / Lapsed |