Hermetically sealed circuit modules having conductive cap anchors

Claim 1

An electronic module comprising, in combination: (a) a multi-layer circuit board comprising a plurality of layers defining circuit paths in a plurality of first layers and insulation in a plurality of second layers between the first layers, and conductive vias extending through selected layers between selected ones of the circuit paths in different ones of the first layers, at least some of the circuit paths being exposed to a top surface of the circuit board; (b) a plurality of circuit components supported on the top surface of the circuit board and electrically connected to selected ones of the exposed circuit paths; (c) a substrate, the multi-layer circuit board being supported on the substrate; (d) a cap anchor formed of a conductive portion in each of the plurality of layers of the circuit board, the conductive portions being stacked between the top surface and the substrate; (e) a cap having a lid and a skirt portion hermetically sealed to the top surface of the circuit board to enclose a region of the circuit board in which the circuit components are supported, the skirt of the cap being sealed to the cap anchor; (f) a plurality of conductive pads on the top surface of the circuit board outside the region enclosed by the cap; and (g) conductive paths connecting individual conductive pads to selected ones of the circuit paths and vias.