US3872583A
Expired / Lapsed
US
⏱️ 0.0 years remaining
LSI chip package and method
Assignee: Fujitsu IT Holdings Inc
•
Filing: 1973-04-05
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Granted: 1975-03-25
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Expires: 1993-04-05
Abstract
Abstract Package for an LSI chip having a plurality of contact pads comprising a carrier and a cover. The carrier is formed of a base of an insulating material and has a generally planar area for receiving the chip. A cooling stud is mounted on the base and can be provided with one or more removable cooling fins. The stud is mounted on the base opposite the area for receiving the chip. Spaced leads are carried by the base and have outer extremities which extend beyond the base in a direction away from the chip and are free of the carrier and have inner extremities which are in close proximity to the area for receiving the chip. A grounding bus is carried by the carrier to facilitate electrical checking of the package.
Inventors
- 👤 Robert J Beall
- 👤 John J Zasio
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:52
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07355; H10W72/075; H10W72/30; H10W72/351; H10W72/352; H10W72/3524; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/5475; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/921; H10W72/926; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
132 words
IN A METHOD FOR FABRICATING AN LSI PACKAGE, FORMING A PLURALITY OF GREEN CERAMIC PARTS, FORMING BY USE OF METALLIZED PAINT A METALLIZED PATTERN ON EACH OF SAID PARTS WITH AT LEAST ONE OF THE PARTS HAVING A PATTERN OF SPACED LEADS EXTENDING FROM AN INNER REGION OF THE PART TO AN OUTER REGION OF THE PART, PLACING A CERAMIC SLURRY BETWEEN THE PARTS FOR FASTENING SAID PARTS TOGETHER AND FOR FILLING VOIDS IN THE PATTERNS ON THE PARTS FIRING SAID PARTS TO FORM A UNITARY CERAMIC BASE HAVING A PLANAR SURFACE WITH THE INNER EXTREMITIES OF SAID PATTERN BEING IN CLOSE PROXIMITY TO SAID SURFACE, SECURING RELATIVELY RIGID LEADS TO THE OUTER EXTEMITIES OF THE PATTERN AND SECURING A COOLING STUD TO SAID BASE IN A REGION OPPOSITE SAID PLANAR SURFACE.
Claim 2
Dependent Claim
132 words
IN A METHOD FOR FABRICATING AN LSI PACKAGE, FORMING A PLURALITY OF GREEN CERAMIC PARTS, FORMING BY USE OF METALLIZED PAINT A METALLIZED PATTERN ON EACH OF SAID PARTS WITH AT LEAST ONE OF THE PARTS HAVING A PATTERN OF SPACED LEADS EXTENDING FROM AN INNER REGION OF THE PART TO AN OUTER REGION OF THE PART, PLACING A CERAMIC SLURRY BETWEEN THE PARTS FOR FASTENING SAID PARTS TOGETHER AND FOR FILLING VOIDS IN THE PATTERNS ON THE PARTS FIRING SAID PARTS TO FORM A UNITARY CERAMIC BASE HAVING A PLANAR SURFACE WITH THE INNER EXTREMITIES OF SAID PATTERN BEING IN CLOSE PROXIMITY TO SAID SURFACE, SECURING RELATIVELY RIGID LEADS TO THE OUTER EXTEMITIES OF THE PATTERN AND SECURING A COOLING STUD TO SAID BASE IN A REGION OPPOSITE SAID PLANAR SURFACE.
Claim 3
Dependent Claim
35 words
A method as in claim 1 together with the step of forming a pattern on the bottom side of the part which assumes the bottom-most position in the assembly, said pattern forming a grounding bus.
Claim 4
Dependent Claim
12 words
A method as in claim 1 wherein said metallized pattern includes tungsten.
Claim 5
Dependent Claim
31 words
A method as in claim 3 together with the step of nickel plating said tungsten after the base has been formed and thereafter gold plating the nickel-plated surfaCes of the base.
Claim 6
Dependent Claim
48 words
A method as in claim 1 together with the step of forming holes extending through said bottom-most part and said one part, filling said holes with said metallized paint so that a conducting path is formed between the lead pattern on said one part and the ground bus.
Claim 7
Dependent Claim
25 words
A method as in claim 1 wherein a preform is secured to said lead pattern and wherein said rigid leads are brazed to said preform.
Claim 8
Dependent Claim
26 words
A method as in claim 1 together with the step of forming said leads so that they extend upwardly and outwardly away from said planar surface.
Claim 9
Dependent Claim
21 words
A method as in claim 1 together with applying a metallized paint to a centrally disposed area of the bottommost part.
Claim 10
Dependent Claim
27 words
A method as in claim 1 together with the step of providing additional cooling surface by removably mounting at least one cooling fin on the cooling stud.
Claim 11
Dependent Claim
63 words
A method as in claim 1 together with the step of mounting a chip in the base on said surface so that the pads carried by the chip are exposed, using a plurality of wires to form connections between the pads and the pattern of spaced leads and placing a cover on base to enclose said chip and the wires forming the connections.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-03-24 | 1978-09-23 | 1979-03-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-03-24 | 1982-09-23 | 1983-03-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-03-24 | 1986-09-23 | 1987-03-25 | $7700.00 | Window Closed / Lapsed |