US5266522A
Expired / Lapsed
US
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Structure and method for corrosion and stress-resistant interconnecting metallurgy
Assignee: International Business Machines Corp
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Filing: 1992-06-05
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Granted: 1993-11-30
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Expires: 2012-06-05
Abstract
Abstract This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.
Inventors
- 👤 Giulio DiGiacomo
- 👤 Armando S. Cammarano
- 👤 Nunzio DiPaolo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H10; H10W; H10W70/00; H10W70/099; H10W90/00; H10W90/701; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
84 words
A method for forming a multilayered interconnecting metallurgical pad for making an electrical contact with an electronic component comprising the steps of: a) depositing a layer of chromium directly on said electronic component, b) depositing a layer of soluble noble metal on said layer of chromium, c) depositing a layer of nickel directly on said layer of soluble noble metal, and d) depositing a layer of noble or relatively noble metal directly on said layer of nickel, thereby forming said multilayered interconnecting metallurgical pad.
Claim 2
Independent Claim
84 words
A method for forming a multilayered interconnecting metallurgical pad for making an electrical contact with an electronic component comprising the steps of: a) depositing a layer of chromium directly on said electronic component, b) depositing a layer of soluble noble metal on said layer of chromium, c) depositing a layer of nickel directly on said layer of soluble noble metal, and d) depositing a layer of noble or relatively noble metal directly on said layer of nickel, thereby forming said multilayered interconnecting metallurgical pad.
Claim 3
Dependent Claim
24 words
The method of claim 1, wherein said soluble noble metal layer is selected from the group consisting of platinum, palladium, rhodium and mixtures thereof.
Claim 4
Dependent Claim
27 words
The method of claim 1, wherein said noble or relatively noble metal is selected from the group consisting of gold, platinum, palladium, rhodium, tin and mixtures thereof.
Claim 5
Dependent Claim
13 words
The method of claim 1, wherein said electronic component is a semiconductor chip.
Claim 6
Dependent Claim
13 words
The method of claim 1, wherein said electronic component is a ceramic substrate.
Claim 7
Dependent Claim
25 words
The method of claim 1, wherein at least a portion of said noble or relatively noble metal layer is in contact with a solder material.
Claim 8
Dependent Claim
26 words
The method of claim 1, wherein at least a portion of said pad makes an electrical contact with at least a portion of a connecting device.
Claim 9
Dependent Claim
29 words
The method of claim 7, wherein said connecting device is selected from a group comprising a wire, a base metallurgical pad, a pin, a solder ball or a connector.
Claim 10
Dependent Claim
41 words
The method of claim 8, wherein said base metallurgical pad has at least one metal, and where said metal is selected from the group consisting of chromium, cobalt, copper, hafnium, molybdenum nickel, niobium, tantalum, titanium, zirconium, noble metals and mixtures thereof.
Claim 11
Dependent Claim
28 words
The method of claim 1, wherein the process for the formation of said pad is selected from a group comprising, chemical vapor deposition, etching, evaporation or sputter deposition.
Claim 12
Dependent Claim
57 words
The method of claim 1, wherein said chromium layer has a thickness from 0.01 to 0.3 micron, said soluble noble metal layer has a thickness from 0.02 to 5.0 micron, said nickel layer has a thickness from 1.0 to 5.0 micron, and said noble or relatively noble metal layer has a thickness from 0.1 to 20.0 micron.
Claim 13
Dependent Claim
14 words
The method of claim 1, wherein said electronic component has at least one via.
Claim 14
Dependent Claim
30 words
The method of claim 12, wherein at least a portion of said layer of chromium makes electrical contact with at least a portion of at least one of said via.
Claim 15
Independent Claim
69 words
A method for forming a multilayered interconnecting metallurgical pad for making an electrical contact with an electronic component comprising the steps of: (a) depositing a layer of chromium directly on said electronic component, b) depositing a layer of nickel directly on said layer of chromium, and c) depositing a layer of noble or relatively noble metal directly on said layer of nickel, thereby forming said multilayered interconnecting metallurgical pad.
Claim 16
Independent Claim
69 words
A method for forming a multilayered interconnecting metallurgical pad for making an electrical contact with an electronic component comprising the steps of: (a) depositing a layer of chromium directly on said electronic component, b) depositing a layer of nickel directly on said layer of chromium, and c) depositing a layer of noble or relatively noble metal directly on said layer of nickel, thereby forming said multilayered interconnecting metallurgical pad.
Claim 17
Dependent Claim
27 words
The method of claim 14, wherein said noble or relatively noble metal is selected from the group consisting of gold, platinum, palladium, rhodium, tin and mixtures thereof.
Claim 18
Dependent Claim
13 words
The method of claim 14, wherein said electronic component is a semiconductor chip.
Claim 19
Dependent Claim
13 words
The method of claim 14, wherein said electronic component is a ceramic substrate.
Claim 20
Dependent Claim
25 words
The method of claim 14, wherein at least a portion of said noble or relatively noble metal layer is in contact with a solder material.
Claim 21
Dependent Claim
26 words
The method of claim 14, wherein at least a portion of said pad makes an electrical contact with at least a portion of a connecting device.
Claim 22
Dependent Claim
29 words
The method of claim 19, wherein said connecting device is selected from a group comprising a wire, a base metallurgical pad, a pin, a solder ball or a connector.
Claim 23
Dependent Claim
41 words
The method of claim 20, wherein said base metallurgical pad has at least one metal, and where said metal is selected from the group consisting of chromium, cobalt, copper, hafnium, molybdenum nickel, niobium, tantalum, titanium, zirconium, noble metals and mixtures thereof.
Claim 24
Dependent Claim
28 words
The method of claim 14, wherein the process for the formation of said pad is selected from a group comprising, chemical vapor deposition, etching, evaporation or sputter deposition.
Claim 25
Dependent Claim
44 words
The method of claim 14, wherein said chromium layer has a thickness from 0.01 to 0.3 micron, said nickel layer has a thickness from 1.0 to 5.0 micron, and said noble or relatively noble metal layer has a thickness from 0.1 to 20.0 micron.
Claim 26
Dependent Claim
14 words
The method of claim 14, wherein said electronic component has at least one via.
Claim 27
Dependent Claim
30 words
The method of claim 24, wherein at least a portion of said layer of chromium makes electrical contact with at least a portion of at least one of said via.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1996-11-29 | 1997-05-31 | 1997-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-29 | 2001-05-31 | 2001-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-29 | 2005-05-31 | 2005-11-30 | $7700.00 | Window Closed / Lapsed |