US5262673A
Expired / Lapsed
US
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Semiconductor element
Assignee: Faurecia Clarion Electronics Co Ltd
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Filing: 1991-03-06
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Granted: 1993-11-16
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Expires: 2011-03-06
Abstract
Abstract A semiconductor element is disclosed, with which it is possible to obtain an area sufficiently large for evacuating heat and to have a high thermal conductivity so as to have an extremely high heat evacuation efficiency by using cooling fins having a microchannel structure.
Inventors
- 👤 Nobuo Mikoshiba
- 👤 Kazuo Tsubouchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:08
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; F; F28; F28D; F28D9/00; H10W40/47; F28F; F28F2260/00; F28F2260/02
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
67 words
A semiconductor element comprising: a semiconductor chip; and a fin body having a microchannel structure bonded to a predetermined surface of said semiconductor chip, in which a plurality of microchannel flow paths are formed, said microchannel structure including a predetermined number of stages which each include at least one of said flow channels and which are arranged successively in a direction substantially perpendicular to said predetermined surface.
Claim 2
Dependent Claim
67 words
A semiconductor element comprising: a semiconductor chip; and a fin body having a microchannel structure bonded to a predetermined surface of said semiconductor chip, in which a plurality of microchannel flow paths are formed, said microchannel structure including a predetermined number of stages which each include at least one of said flow channels and which are arranged successively in a direction substantially perpendicular to said predetermined surface.
Claim 3
Dependent Claim
18 words
A semiconductor element according to claim 1 wherein said fin body is directly bonded to said semiconductor chip.
Claim 4
Dependent Claim
21 words
A semiconductor element according to claim 1 wherein said fin body is bonded to said semiconductor chip through an adhesive layer.
Claim 5
Dependent Claim
26 words
A semiconductor element according to claim 1 wherein liquid serving as a cooling medium is supplied to said microchannel flow paths formed in said fin body.
Claim 6
Dependent Claim
26 words
A semiconductor element according to claim 1 wherein gas serving as a cooling medium is supplied to said microchannel flow paths formed in said fin body.
Claim 7
Dependent Claim
29 words
A semiconductor element according to claim 1 wherein said fin body is made of a material, which is different from a material, of which said semiconductor chip is made.
Claim 8
Dependent Claim
31 words
A semiconductor element according to claim 1 wherein the cross section of each of said microchannel flow paths formed in said fin body is smaller than about 1 mm 2 .
Claim 9
Dependent Claim
21 words
A semiconductor element according to claim 1 wherein said fin body is combined with an I/O pin package in one body.
Claim 10
Dependent Claim
20 words
A semiconductor element according to claim 1 wherein at least one heat diffusing layer is formed in said semiconductor chip.
Claim 11
Dependent Claim
27 words
A semiconductor element according to claim 1 wherein said fin body is bonded to the surface at a place close to working regions in said semiconductor chip.
Claim 12
Dependent Claim
21 words
A semiconductor element according to claim 9 wherein said heat diffusing layer is a thermally highly conductive and electrically insulating layer.
Claim 13
Dependent Claim
31 words
A semiconductor element according to claim 1 including a further fin body bonded to a further surface of said semiconductor chip and having formed therein a plurality of microchannel flow paths.
Claim 14
Dependent Claim
16 words
A semiconductor element according to claim 1, wherein said predetermined number of said stages is four.
Claim 15
Dependent Claim
17 words
A semiconductor element according to claim 11, wherein the material of said heat diffusing layer is AlN.
Claim 16
Dependent Claim
63 words
A semiconductor element comprising: a semiconductor chip including circuit elements and at least one heat diffusing layer, some of said circuit elements in said semiconductor chip being formed as a unit with said heat diffusing layer; and a fin body having a microchannel structure bonded to a predetermined surface of said semiconductor chip, in which a plurality of microchannel flow paths are formed.
Claim 17
Dependent Claim
63 words
A semiconductor element comprising: a semiconductor chip including circuit elements and at least one heat diffusing layer, some of said circuit elements in said semiconductor chip being formed as a unit with said heat diffusing layer; and a fin body having a microchannel structure bonded to a predetermined surface of said semiconductor chip, in which a plurality of microchannel flow paths are formed.
Claim 18
Dependent Claim
41 words
The semiconductor element according to claim 15, wherein the microchannel structure includes a predetermined number of stages which each include at least one of said flow channels and which are arranged successively in a direction substantially perpendicular to said predetermined surface.
Claim 19
Dependent Claim
16 words
The semiconductor element according to claim 16, wherein said predetermined number of said stages is four.
Claim 20
Dependent Claim
18 words
A semiconductor element according to claim 15, wherein said fin body is directly bonded to said semiconductor chip.
Claim 21
Dependent Claim
21 words
A semiconductor element according to claim 15, wherein said fin body is bonded to said semiconductor chip through an adhesive layer.
Claim 22
Dependent Claim
26 words
A semiconductor element according to claim 15, wherein liquid serving as a cooling medium is supplied to said microchannel flow paths formed in said fin body.
Claim 23
Dependent Claim
26 words
A semiconductor element according to claim 15, wherein gas serving as a cooling medium is supplied to said microchannel flow paths formed in said fin body.
Claim 24
Dependent Claim
29 words
A semiconductor element according to claim 15, wherein said fin body is made of a material which is different from a material of which said semiconductor chip is made.
Claim 25
Dependent Claim
31 words
A semiconductor element according to claim 15, wherein the cross section of each of said microchannel flow paths formed in said fin body is smaller than about 1 mm 2 .
Claim 26
Dependent Claim
21 words
A semiconductor element according to claim 15, wherein said fin body is combined with an I/O pin package in one body.
Claim 27
Dependent Claim
27 words
A semiconductor element according to claim 15, wherein said fin body is bonded to the surface at a place close to working regions in said semiconductor chip.
Claim 28
Dependent Claim
21 words
A semiconductor element according to claim 15, wherein said heat diffusing layer is a thermally highly conductive and electrically insulating layer.
Claim 29
Dependent Claim
31 words
A semiconductor element according to claim 15, including a further fin body bonded to a further surface of said semiconductor chip and having formed therein a plurality of microchannel flow paths.
Claim 30
Dependent Claim
16 words
A semiconductor element according to claim 15, wherein the material of said diffusing layer is AlN.
Claim 31
Dependent Claim
84 words
A semiconductor element comprising: a semiconductor chip; a pair of fin bodies respectively bonded to opposed surfaces of said semiconductor chip, each of said fin bodies having therein a microchannel structure including a predetermined number of stages which are arranged successively in a direction perpendicular to the surface of said semiconductor chip to which the fin body is bonded and which each include at least one flow channel; and a predetermined number of pins electrically connected to a circuit formed on said semiconductor chip.
Claim 32
Dependent Claim
84 words
A semiconductor element comprising: a semiconductor chip; a pair of fin bodies respectively bonded to opposed surfaces of said semiconductor chip, each of said fin bodies having therein a microchannel structure including a predetermined number of stages which are arranged successively in a direction perpendicular to the surface of said semiconductor chip to which the fin body is bonded and which each include at least one flow channel; and a predetermined number of pins electrically connected to a circuit formed on said semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |