EP0241290A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Cooling system for electronic components
Assignee: NEC Corp
•
Filing: 1987-04-09
•
Granted: —
•
Expires: 2007-04-09
Abstract
Abstract An IC substrate (3) carrying IC's (14) is fitted into a connector frame (2). Heat passes to a heat-conductive block (6), and thence to a plate (8) provided with coolant channels, by way of a flexible adhesive layer (4) and a low melting point metal or wax layer (5), these layers ensuring good, gap-free thermal contact between a substrate (3) and the block (6). The layer (5) can be melted when it is necessary to replace the substrate (3).
Inventors
- 👤 Tsukasa Mizuno
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 15:26
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/60; H10W40/611; H10W40/20; H10W40/231; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
73 words
A cooling system comprising a substrate (3) carrying electronic components (14), a first layer (4) made of an adhesive provided on one surface of the substrate, a second layer (5) made of a material having a relatively low melting point and provided on the first layer, and heat-removing means (6, 8) provided on the second layer to disperse heat transmitted from said components through said substrate, said first layer and said second layer.
Claim 2
Dependent Claim
73 words
A cooling system comprising a substrate (3) carrying electronic components (14), a first layer (4) made of an adhesive provided on one surface of the substrate, a second layer (5) made of a material having a relatively low melting point and provided on the first layer, and heat-removing means (6, 8) provided on the second layer to disperse heat transmitted from said components through said substrate, said first layer and said second layer.
Claim 3
Dependent Claim
21 words
A cooling system according to claim 1, characterised in that the heat-removing means (6, 8) comprise a heat conductive block (6).
Claim 4
Dependent Claim
25 words
A cooling system according to claim 1 or 2, characterised in that the heat-removing means (6, 8) comprise a plate (8) with coolant channels therein.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.