EP0167033A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Apparatus for conduction cooling
Assignee: International Business Machines Corp
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Filing: 1985-06-14
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Granted: —
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Expires: 2005-06-14
Abstract
Abstract Disclosed is a device to thermally couple a heat dissipating intergrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc (23) which is spring (26) loaded on the back of the chip (20) and a heat conductive hat member (27) having an opening with a continuous tapered wall (28) to conformally fit over the truncated conical disc (23). The gap between the disc (23) and the hat (27) is packed with a thin layer of a high thermal conductivity grease (33) to provide a low interfacial thermal resistance and mechanical flexibility between the disc (23) and the hat (27). For additional cooling enhancement of the chip (20), at the interface between the chip back surface and the base of the disc (23) a self-healing alloy (34) having a high thermal conductivity and low melting point is provided.
Inventors
- 👤 Carl David Ostergren
- 👤 John Angelo Paivanas
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 08:03
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
129 words
An apparatus for conduction cooling of a heat generating element (20), characterized by a thermally conductive truncated solid conical member (23) having a flat base in thermal communication with said element (20) via said base; a thermally conductive cap member (27) having a flat top portion and a bottom portion having a cavity with a flat ceiling and a continuous tapered wall (28) to mate substantially with said truncated conical member (23); means (26) interposed between said ceiling and said conical member (23) therebeneath for resiliently pressing said conical member (23) against said element (20); a thermally conductive grease layer (33) interposed between said conical member (23) and the tapered wall of said cavity; and heat sink means associated with said flat top portion of the cap member (27).
Claim 2
Independent Claim
129 words
An apparatus for conduction cooling of a heat generating element (20), characterized by a thermally conductive truncated solid conical member (23) having a flat base in thermal communication with said element (20) via said base; a thermally conductive cap member (27) having a flat top portion and a bottom portion having a cavity with a flat ceiling and a continuous tapered wall (28) to mate substantially with said truncated conical member (23); means (26) interposed between said ceiling and said conical member (23) therebeneath for resiliently pressing said conical member (23) against said element (20); a thermally conductive grease layer (33) interposed between said conical member (23) and the tapered wall of said cavity; and heat sink means associated with said flat top portion of the cap member (27).
Claim 3
Dependent Claim
46 words
The apparatus as claimed in claim 1, characterized by a self-healing alloy layer (34) between said element (20) and flat base, said alloy having a low melting point and high thermal conductivity, to enhance transfer of heat from said element (20) to said conical member (23).
Claim 4
Dependent Claim
129 words
An apparatus as claimed in claim 1 or 2 for cooling a heat generating semiconductor integrated circuit chip (20) characterized by a heat conductive flat-based and truncated solid conical disc (23), said base contacting the back surface of said chip (20); a heat conductive, thick-walled hat (27) having a tapered inner surface (28) essentially conforming to said truncated disc (23); a spring member (26) located between said hat (27) and said disc (23) for forcing the disc (23) against the chip (20) and forming a narrow peripheral gap between the conical portion of said disc (23) and said tapered surface of the hat (27); and conductive thermal grease (33) filled in said peripheral gap for providing a low interfacial thermal resistance between the disc (23) and the hat (27).
Claim 5
Dependent Claim
30 words
The apparatus as claimed in claim 3 wherein said conical portion of the disc (23) having a surface area about 5 to 10 times the area of said chip (20).
Claim 6
Independent Claim
36 words
The apparatus as claimed in claims 1 to 4, characterized by a cavity (25) in a central portion of the truncated end of said disc for retaining therein the lower portion of said spring member (26).
Claim 7
Dependent Claim
43 words
The apparatus as claimed in claim 3, characterized by said hat (27) having a flat ceiling (29) with a central cavity (31) in correspondence with the cavity (25) in said disc (23) for retaining therein the upper portion of said spring member (26).
Claim 8
Dependent Claim
191 words
A module for cooling a plurality of heat generating semiconductor integrated circuit chips (20) mounted face-down to a substrate (21), characterized by a plurality of heat conductive, truncated solid conical discs (23) having a flat base, each in thermal contact with one of said chips (20) via said base; a heat conductive module cap member sealed at the edges thereof to said substrate (21) enclosing said plurality of chips (20), said cap member having therein a plurality of cavities, each in correspondence with one of said discs (23), said cavities each having a flat ceiling (29) and a continuous outwardly tapered wall (28) to mate with said corresponding disc (23); a plurality of springs (26) one compressed between each of said cavity ceilings (29) and said corresponding truncated disc (23) to maintain said discs pressed against respective chips (20) and also establish small peripheral gaps between the tapered wall of said cavities and the corresponding discs; a thermal conductive grease (33) filled in said peripheral gaps; and heat removal means thermally coupled to said module cap member for externally removing the heat generated by said chips (20) from said cap member.
Claim 9
Dependent Claim
191 words
A module for cooling a plurality of heat generating semiconductor integrated circuit chips (20) mounted face-down to a substrate (21), characterized by a plurality of heat conductive, truncated solid conical discs (23) having a flat base, each in thermal contact with one of said chips (20) via said base; a heat conductive module cap member sealed at the edges thereof to said substrate (21) enclosing said plurality of chips (20), said cap member having therein a plurality of cavities, each in correspondence with one of said discs (23), said cavities each having a flat ceiling (29) and a continuous outwardly tapered wall (28) to mate with said corresponding disc (23); a plurality of springs (26) one compressed between each of said cavity ceilings (29) and said corresponding truncated disc (23) to maintain said discs pressed against respective chips (20) and also establish small peripheral gaps between the tapered wall of said cavities and the corresponding discs; a thermal conductive grease (33) filled in said peripheral gaps; and heat removal means thermally coupled to said module cap member for externally removing the heat generated by said chips (20) from said cap member.
Claim 10
Dependent Claim
64 words
The cooling module as claimed in claim 7, characterized by a self-healing alloy interface (34) formed between each of said chips (20) and the corresponding disc base (23), said alloy having a high thermal conductivity and low melting point, due to heat from said corresponding disc, being capable of melting and providing a low interfacial thermal resistance between said chip (20) and disc (23).
Claim 11
Dependent Claim
29 words
The cooling module as recited in claim 7 wherein said discs (23) are fabricated from a material selected from the group consisting of aluminum, copper, silver and silicon carbide.
Claim 12
Dependent Claim
32 words
1 0 . The cooling module as recited in claim 7 wherein said module cap is fabricated from a material selected from the group consisting of aluminum, copper, silver and silicon carbide.
References Cited (Backward Citations)
No citation records indexed.
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