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US5262660A Expired / Lapsed US ⏱️ 0.0 years remaining

High power pseudomorphic gallium arsenide high electron mobility transistors

Assignee: Northrop Grumman Systems Corp
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Filing: 1991-08-01
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Granted: 1993-11-16
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Expires: 2011-08-01
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Abstract

Abstract A high power pseudomorphic (PM) AlGaAs/InGaAs high electron mobility transistor (HEMT) (26) with improved gain at 94 GHz. The transistor (26) includes an InGaAs quantum well (32) having a silicon planar doping layer (34) located at the bottom. A donor layer (36) comprises AlGaAs with a silicon planar doping layer (37). The resulting transistor (26) exhibits superior gain and noise characteristics that relatively high power levels when operating at 94 GHz. The transistor (26) is produced using an optimized growth process which involves growing the quantum well at a relatively low temperature and then raising the temperature to grow subsequent layers.

Inventors

  • 👤 Dwight C. Streit
  • 👤 Kin L. Tan
  • 👤 Po-Hsin Liu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 09:28
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/40; H10D30/47; H10D30/471; H10D30/475; H10D30/4755

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 114 words
A gallium arsenide (GaAs) field effect transistor comprising: a GaAs substrate layer; a buffer layer deposited on top of said GaAs substrate; an InGaAs quantum well deposited on top of said buffer; a layer of silicon planar doping within said InGaAs quantum well, and deposited near the bottom of said InGaAs quantum well; a donor layer of AlGaAs deposited on top of said InGaAs quantum well; an n-type GaAs contact layer deposited on top of said AlGaAs donor layer; a gate structure deposited on said AlGaAs donor layer between gaps in said GaAs layer; and source and drain ohmic layers deposited on top of said GaAs layer on opposite sides of said gate structure.
Claim 2
Dependent Claim 114 words
A gallium arsenide (GaAs) field effect transistor comprising: a GaAs substrate layer; a buffer layer deposited on top of said GaAs substrate; an InGaAs quantum well deposited on top of said buffer; a layer of silicon planar doping within said InGaAs quantum well, and deposited near the bottom of said InGaAs quantum well; a donor layer of AlGaAs deposited on top of said InGaAs quantum well; an n-type GaAs contact layer deposited on top of said AlGaAs donor layer; a gate structure deposited on said AlGaAs donor layer between gaps in said GaAs layer; and source and drain ohmic layers deposited on top of said GaAs layer on opposite sides of said gate structure.
Claim 3
Dependent Claim 14 words
The transistor of claim 1 wherein said buffer layer is a superlattice type material.
Claim 4
Dependent Claim 28 words
The transistor of claim 1 wherein said InGaAs layer is approximately 150 angstroms thick and said silicon planer doping layer is located approximately 50 angstroms from the buffer.
Claim 5
Dependent Claim 16 words
The transistor of claim 3 wherein said InGaAs layer has an Indium mole fraction of 22%.
Claim 6
Dependent Claim 24 words
The transistor of claim 1 wherein said silicon planar doping layer in said InGaAs quantum well is composed of 1×10 12 cm -2 Si.
Claim 7
Dependent Claim 18 words
The transistor of claim 1 wherein said AlGaAs donor layer includes a silicon planer doping layer deposited within.
Claim 8
Dependent Claim 15 words
The transistor of claim 1 wherein said AlGaAs donor layer is approximately 300 angstroms thick.
Claim 9
Dependent Claim 17 words
The transistor of claim 7 wherein said AlGaAs layer has an aluminum mole fraction of approximately 25%.
Claim 10
Dependent Claim 17 words
The transistor of claim 1 wherein said n type GaAs contact layer is approximately 400 angstroms thick.
Claim 11
Dependent Claim 17 words
The transistor of claim 1 wherein said gate is a T-shaped gate of approximately 0.1-μm in length.
Claim 12
Dependent Claim 140 words
A high power pseudomorphic AlGaAs/InGaAs HEMT for use at microwave frequencies comprising: a GaAs substrate layer; a superlattice buffer layer deposited on top of said GaAs substrate; an InGaAs quantum well deposited on top of said buffer having an Indium mole fraction of approximately 22%, said quantum well being approximately 150 angstroms thick; a layer of silicon planar doping within said InGaAs quantum well deposited approximately 50 angstroms from the superlattice buffer; a donor layer of AlGaAs deposited on top of said InGaAs quantum well; an n-type GaAs contact layer deposited on top of said AlGaAs donor layer; a T-shaped gate structure of approximately 0.1 μm in length deposited on said AlGaAs donor layer between gaps in said GaAs layer; and source and drain ohmic layers deposited on top of said GaAs layer on opposite sides of said gate structure.
Claim 13
Dependent Claim 140 words
A high power pseudomorphic AlGaAs/InGaAs HEMT for use at microwave frequencies comprising: a GaAs substrate layer; a superlattice buffer layer deposited on top of said GaAs substrate; an InGaAs quantum well deposited on top of said buffer having an Indium mole fraction of approximately 22%, said quantum well being approximately 150 angstroms thick; a layer of silicon planar doping within said InGaAs quantum well deposited approximately 50 angstroms from the superlattice buffer; a donor layer of AlGaAs deposited on top of said InGaAs quantum well; an n-type GaAs contact layer deposited on top of said AlGaAs donor layer; a T-shaped gate structure of approximately 0.1 μm in length deposited on said AlGaAs donor layer between gaps in said GaAs layer; and source and drain ohmic layers deposited on top of said GaAs layer on opposite sides of said gate structure.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-11-15 1997-05-17 1997-11-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-11-15 2001-05-17 2001-11-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-11-15 2005-05-17 2005-11-16 $7700.00 Window Closed / Lapsed

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