US5227315A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of introduction and diffusion of platinum ions in a slice of silicon
Assignee: CORIMME Consorzio per Ricerca Sulla Microelettronica nel Mezzogiorno
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Filing: 1991-11-19
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Granted: 1993-07-13
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Expires: 2011-11-19
Abstract
Abstract A process is provided for introduction and diffusion of platinum ions in a slice of silicon material. The slice of silicon is subjected to a succession of thermal steps at high temperature for the formation of at least one semiconductor device. Later processing steps include the opening of contacts and surface metallization. Platinum ions are introduced by ionic implant prior to the metallization step.
Inventors
- 👤 Ferruccio Frisina
- 👤 Nella Tavolo
- 👤 Mario Raspagliesi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 17:38
CPC Classifications
H; H10; H10P; H10P32/00; H10P32/10; H10P32/18; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10P30/208; H10P32/17; H10P32/171; Y; Y10; Y10S; Y10S438/00; Y10S438/904; Y10S438/914; Y10S438/917
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
126 words
A process of introduction and diffusion of platinum ions in a slice of silicon, comprising subjecting the slice to a succession of thermal steps at high temperature for the formation of at least one semiconductor device and to subsequent steps for the opening of contacts and for surface metallizaiton, characterized in that the introduction of platinum ions is performed by ionic implant before the metallization step, wherein the implant of the platinum ions takes place with a dose that is lower than the solid solubility in the semiconductor at the diffusion temperature, and wherein a time of diffusion is used so as to obtain, once the diffusion has taken place, a profile of resistivity that is constant throughout the entire thickness of the slice of silicon.
Claim 2
Dependent Claim
126 words
A process of introduction and diffusion of platinum ions in a slice of silicon, comprising subjecting the slice to a succession of thermal steps at high temperature for the formation of at least one semiconductor device and to subsequent steps for the opening of contacts and for surface metallizaiton, characterized in that the introduction of platinum ions is performed by ionic implant before the metallization step, wherein the implant of the platinum ions takes place with a dose that is lower than the solid solubility in the semiconductor at the diffusion temperature, and wherein a time of diffusion is used so as to obtain, once the diffusion has taken place, a profile of resistivity that is constant throughout the entire thickness of the slice of silicon.
Claim 3
Dependent Claim
36 words
The process according to claim 1, characterized in that the implant of the platinum ions is performed on the rear of the slice of silicon before the formation of the contacts and of the metallization step.
Claim 4
Dependent Claim
36 words
The process according to claim 1, characterized in that the implant of the platinum ions is performed on the front of the slice of silicon after the formation of the contacts and before the metallization step.
Claim 5
Dependent Claim
17 words
The process according to claim 1, characterized in that said dose ranges from 1012 atoms/cm2to 1014 atoms/cm2.
Claim 6
Dependent Claim
24 words
The process according to claim 1, characterized in that the diffusion of platinum in the slice of silicon takes place in a nitrogen atmosphere.
Claim 7
Dependent Claim
19 words
The process according to claim 1, characterized in that the time of diffusion ranges from 1 to 10 hours.
Claim 8
Dependent Claim
17 words
The process according to claim 1, characterized in that said semiconductor device is a power MOS device.
Claim 9
Dependent Claim
19 words
The process according to claim 1, characterized in that said semiconductor device is an Insulated Gate Bipolar Transistor device.
Claim 10
Independent Claim
94 words
A method for forming a semiconductor device, comprising the steps of: forming at least one active semiconductor device in a silicon slice, including formation of an overlying insulating layer; implanting platinum ions into the slice; diffusing the implanted ions through the slice for a time and at a temperature sufficient to obtain a concentration profile for the platinum which is substantially constant throughout the thickness of the substrate; forming contact opening through the insulating layer; and metallizing the device, including forming metal contacts to the slice through the openings in the overlying insulating layer.
Claim 11
Independent Claim
94 words
A method for forming a semiconductor device, comprising the steps of: forming at least one active semiconductor device in a silicon slice, including formation of an overlying insulating layer; implanting platinum ions into the slice; diffusing the implanted ions through the slice for a time and at a temperature sufficient to obtain a concentration profile for the platinum which is substantially constant throughout the thickness of the substrate; forming contact opening through the insulating layer; and metallizing the device, including forming metal contacts to the slice through the openings in the overlying insulating layer.
Claim 12
Dependent Claim
34 words
The method of claim 9, wherein said step of forming contact openings is performed before said implanting step, and the platinum is implanted into the slice through the openings in the overlying insulating layer.
Claim 13
Dependent Claim
35 words
The method of claim 9, wherein said step of forming contact openings is performed after said diffusing step, and wherein the platinum is implanted into the slice through a surface opposite the overlying insulating layer.
Claim 14
Dependent Claim
27 words
The method of claim 9, wherein the concentration of implanted platinum is less than the solid solubility of platinum in the slice material at the diffusion temperature.
Claim 15
Dependent Claim
20 words
The method of claim 9, wherien said diffusion step comprises the step of heating the slice in a nitrogen atmosphere.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-12 | 1997-01-11 | 1997-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-12 | 2001-01-11 | 2001-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-12 | 2005-01-11 | 2005-07-13 | $7700.00 | Window Closed / Lapsed |