Molded package for semiconductor devices with leadframe locking structure

Claim 1

A semiconductor package comprising: a conductive mounting platform for a semiconductor device comprising at least one encapsulant engaging member, an interior conductive surface and an exterior conductive surface; a semiconductor device having a first electrical contact and a second electrical contact, wherein said semiconductor device is positioned on said interior conductive surface of said conductive mounting platform such that said first electrical contact is in conductive contact with said interior conductive surface, and said second electrical contact is in conductive contact with at least one conductive lead; an encapsulant anchored to said conductive mounting platform by said at least one encapsulant engaging member, said encapsulant forming a shell-like covering over said semiconductor device, wherein said exterior conductive surface and said at least one encapsulant engaging member are exposed for heat dissipation, and wherein said encapsulant engaging member comprises an exterior wall portion of said encapsulant; said at least one conductive lead comprising a first end and a second end, said first end in contact with said second electrical contact of said semiconductor device, and said second end exterior to said encapsulant; said semiconductor package manufactured by a process comprising the steps of: forming a lower leadframe comprising said conductive mounting platform for said semiconductor device, said conductive mounting platform extending from a side of said lower leadframe toward a side of an upper leadframe; forming an upper leadframe comprising said at least one conductive lead, said at least one conductive lead extending from said side of said upper leadframe toward said side of said lower leadframe; attaching said semiconductor device to said conductive mounting platform so that a conductive connection is made; positioning said contact surface of said at least one conductive lead of said upper leadframe on said second electrical contact of said semiconductor device; bending said at least one encapsulant engaging member to a predetermined angle with respect to a plane defined by said upper conductive surface of said conductive mounting platform; forming said encapsulant over said contact surface of said at least one conductive lead, over said semiconductor device and around said at least one encapsulant engaging member, thereby sealing said semiconductor device within a protective shell, and leaving said exterior conductive surface and said at least one conductive lead exposed for electrical connection, and said exterior conductive surface and said at least one encapsulant engaging member exposed for heat dissipation, said at least one encapsulant engaging member comprising said exterior wall portion of said encapsulant; and separating said conductive mounting platform from said lower leadframe and separating said at least one conductive lead from said upper leadframe.