Surface mount method and device

Claim 3

A device according to claim 1 wherein the said socket means retains said component therein but exposes locations where said J-shaped leads are to be soldered to said second portions of said contact elements for providing access for soldering said second portions to said J-shaped leads and for visually inspecting a resulting solder joint.

Claim 4

A device according to claim 1 wherein said socket means comprises a generally elongate U-shaped member having a transverse portion for placement adjacent to the surface of said printed circuit board and two substantially parallel wall portions extending therefrom.

Claim 5

A device according to claim 3 wherein said wall portions have respective distal shoulder portions having a larger cross section than the rest of the wall portion for cooperating with peripheral portions of said body member of said component to provide an interference fit between said body member of said component and said U-shaped member such that said body member snaps into place when said body member is inserted into said socket means.

Claim 6

A device according to claim 3 wherein said plurality of contact elements are mounted on said transverse portion of said U-shaped member.

Claim 7

A device according to claim 5 wherein said first portions of said contact elements lie in a plane substantially parallel to said transverse portion of said U-shaped member and each of said second portions of said contact elements lie in a plane substantially normal to said transverse portion of said U-shaped member.

Claim 8

A device according to claim 5 wherein said transverse portion includes adhesive means for securing said U-shaped member to a printed circuit board.

Claim 9

A device according to claim 5 wherein said said plurality of contact elements comprise one contact element for each of the J-leads on said electrical component.

Claim 10

A device according to claim 5 wherein said transverse portion of said U-shaped member and said first portions of said contact elements have coengageable means integral therewith for securing said first portions of said contact elements to said transverse portion.

Claim 11

A device according to claim 9 wherein said transverse portion includes an upper surface against which said electrical component abuts when it is inserted into said socket means and a lower board mounting surface, and said coengageable means comprises: protrusion means on said first portions of said contact elements; a plurality of slit means disposed between said upper and lower surfaces; and a plurality of recesses provided in the upper and lower surfaces of said transverse portion, said slit means opening into said recesses, whereby, upon insertion of said first portions of said contact elements into said slit means, said protrusion means interfere with the sides of the slit means as said protrusion means passes through said slit means and, thereafter, snap into place when said protrusion means enter into said recesses.

Claim 12

A device according to claim 10 wherein said first portions of said contact elements lie in a plane disposed between and parallel to the planes in which the upper and lower surfaces of said transverse portion lie.

Claim 13

A surface mount electrical component assembly comprising: a substrate having a mounting surface and having a circuit pattern formed on such mounting surface, said circuit pattern including spaced conductive pads; at least one socket means for receiving a surface mount electrical component; an electrical component positioned in said socket means, said component comprising a body member and a plurality of J-shaped leads; and a plurality of contact elements mounted on said socket means, said contact elements comprising one contact element for each J-shaped lead of said electrical component, each of said contact elements having a first portion soldered to one of said conductive pads and a second portion soldered to one of said J-leads of said electrical component, said first portion extending away from said socket means, and said second portion being at a distal end of said first portion to define an intermediate portion between the socket means and the second portion that overlays the conductive pad, each said first portion being soldered to said conductive pad at said intermediate portion, said intermediate portion providing a visual access space for inspecting a solder joint before said electrical component is positioned in said socket.

Claim 14

A surface mount electrical component assembly comprising: a substrate having a mounting surface and having a circuit pattern formed on such mounting surface, said circuit pattern including spaced conductive pads; at least one socket means for receiving a surface mount electrical component; an electrical component positioned in said socket means, said component comprising a body member and a plurality of J-shaped leads; and a plurality of contact elements mounted on said socket means, said contact elements comprising one contact element for each J-shaped lead of said electrical component, each of said contact elements having a first portion soldered to one of said conductive pads and a second portion soldered to one of said J-leads of said electrical component, said first portion extending away from said socket means, and said second portion being at a distal end of said first portion to define an intermediate portion between the socket means and the second portion that overlays the conductive pad, each said first portion being soldered to said conductive pad at said intermediate portion, said intermediate portion providing a visual access space for inspecting a solder joint before said electrical component is positioned in said socket.

Claim 15

A surface mount electrical component assembly according to claim 12 wherein said socket means comprises a generally elongate U-shaped member having a transverse portion and two substantially parallel wall portions extending therefrom.

Claim 16

A surface mount electrical component assembly according to claim 13 wherein said transverse portion includes an upper surface against which the bottom surface of said electrical component abuts and a lower board mounting surface.

Claim 17

A surface mount electrical component assembly according to claim 14 wherein said plurality of contact elements are mounted on said transverse portion.

Claim 18

A surface mount electrical component assembly according to claim 15 wherein said transverse portion and said first portions of said contact elements have coengageable means integral therewith for securing said transverse portion and said first portions to each other.

Claim 19

A surface mount electrical component assembly according to claim 16 wherein said coengageable means comprises: a protrusion means on said first portions of said contact elements; a plurality of slit means disposed between said upper and lower surfaces of said transverse portion; and a plurality of recesses provided in the upper and lower surfaces of said transverse portion, said slit means opening into said recesses, said first portions of said contact elements passing through said slit means with said protrusion means being disposed in said recesses, the width of said first portions at said protrusion means being wider than the width of said slit means.

Claim 20

A surface mount electrical component assembly according to claim 17 said wall portions have shoulder portions adjacent their distal ends having a larger cross section than the rest of the wall portions, said shoulder portions cooperating with peripheral portions of said body member of said electrical component to provide an interference fit between said body member and said U-shaped member such that said body member snaps into place when said body member is inserted into said U-shaped member.

Claim 23

A method according to claim 19 wherein said contact elements each have a second portion which is positioned adjacent to a leg portion of a J-shaped lead when said J-lead surface mount electrical component is inserted into said socket means and wherein step (d) comprises soldering said second portions to said leg portions of said J-shaped leads.

Claim 26

The method of claim 21 wherein the step (a) includes the sub step of applying heat energy to the J-leads of the electrical component such that solder on the J-leads melts.

Claim 27

The method of claim 21 wherein the contact elements of the socket means have solder thereon.