Abstract A chip type tantalum capacitor has an insulating resin frame, a pair of substantially flat metal foil terminals bonded to both sides of the frame, at least one of the frame sides having a slit therethrough and open to the outside of the metal foil terminal on the one frame side, the metal foil terminal on the one frame side being a metal selected from the group consisting of copper and nickel. A tantalum capacitor element having a pair of terminals is enclosed in the frame, at least one of the element terminals being a lead wire made of tantalum, the lead wire extending through the slit and outside the metal foil terminal on the one side of the frame and being bent at the outside surface of the metal foil terminal with the bent portion of the lead wire outside the metal foil terminal extending along the surface of the metal foil terminal and being welded to the metal foil terminal surface for being fixed thereto, the other element terminal being electrically connected to the other metal foil terminal. An insulating resin is potted in the space inside the frame and around the capacitor element.
A chip type tantalum capacitor comprising: an insulating resin frame; a pair of substantially flat metal foil terminals bonded to both sides of said frame, at least one of said frame sides having a slit therethrough an open to the outside of said metal foil terminal on said one frame side, said metal foil terminal on said one frame side being a metal selected from the group consisting of copper and nickel; a tantalum capacitor element having a pair of terminals and enclosed in said frame, at least one of said element terminals being a lead wire made of tantalum, said lead wire extending through said slit and outside said metal foil terminal on said one side of said frame and being bent at the outside surface of said metal foil terminal with the bent portion of the lead wire outside said metal foil terminal extending along the surface of said metal foil terminal and being welded to said metal foil terminal surface for being fixed thereto, the other element terminal being electrically connected to the other metal foil terminal; and an insulating resin potted in the space inside said frame and around said capacitor element.
Claim 2
Dependent Claim
196 words
A chip type tantalum capacitor comprising: an insulating resin frame; a pair of substantially flat metal foil terminals bonded to both sides of said frame, at least one of said frame sides having a slit therethrough an open to the outside of said metal foil terminal on said one frame side, said metal foil terminal on said one frame side being a metal selected from the group consisting of copper and nickel; a tantalum capacitor element having a pair of terminals and enclosed in said frame, at least one of said element terminals being a lead wire made of tantalum, said lead wire extending through said slit and outside said metal foil terminal on said one side of said frame and being bent at the outside surface of said metal foil terminal with the bent portion of the lead wire outside said metal foil terminal extending along the surface of said metal foil terminal and being welded to said metal foil terminal surface for being fixed thereto, the other element terminal being electrically connected to the other metal foil terminal; and an insulating resin potted in the space inside said frame and around said capacitor element.
Claim 3
Dependent Claim
18 words
A chip type tantalum capacitor according to claim 1, wherein said metal foil terminal is nickel plated copper.
Claim 4
Dependent Claim
27 words
A chip type tantalum capacitor according to claim 1, wherein said insulating resin frame is rectangular, and said metal foil terminal is bonded thereto by an adhesive.