Positive control of the source/drain-gate overlap in self-aligned TFTS via a top hat gate electrode configuration

Claim 1

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate; depositing a second gate conductor layer over said first gate conductor layer, said second gate conductor layer being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; removing any remaining photoresist; depositing over said substrate and said first and second gate conductor layers a substantially conformal gate dielectric layer, depositing over said gate dielectric layer a substantially conformal semiconductor material layer, and depositing over said semiconductor material layer a substantially conformal source/drain metallization layer such that said gate conductor topography is propagated upward through each of said layers; applying a planarization layer over said source/drain metallization layer; planarizing said planarization layer to expose at least a portion of said source/drain metallization layer disposed over and corresponding to an uppermost portion of said patterned gate conductor topography; and etching said source/drain metallization layer to form self-aligned source and drain electrodes disposed over said first gate conductor layer at least by said selected overlap distance.

Claim 2

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate; depositing a second gate conductor layer over said first gate conductor layer, said second gate conductor layer being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; removing any remaining photoresist; depositing over said substrate and said first and second gate conductor layers a substantially conformal gate dielectric layer, depositing over said gate dielectric layer a substantially conformal semiconductor material layer, and depositing over said semiconductor material layer a substantially conformal source/drain metallization layer such that said gate conductor topography is propagated upward through each of said layers; applying a planarization layer over said source/drain metallization layer; planarizing said planarization layer to expose at least a portion of said source/drain metallization layer disposed over and corresponding to an uppermost portion of said patterned gate conductor topography; and etching said source/drain metallization layer to form self-aligned source and drain electrodes disposed over said first gate conductor layer at least by said selected overlap distance.

Claim 6

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate; depositing a second gate conductor layer over said first gate conductor layer, said second conductor being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self-aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; depositing a substantially conformal dielectric layer over said patterned gate conductor and exposed portions of said substrate upper surface; depositing a substantially conformal layer of semiconductor material over said dielectric layer; depositing a layer of source/drain metallization over said semiconductor material layer; forming a planarization layer of a planarization material over the source/drain metallization, said planarization layer having a substantially planar exposed surface; uniformly removing said planarization material until said source/drain metallization is exposed in alignment with raised portions of said second gate conductor layer; and selectively removing the exposed source/drain metallization to expose the underlying semiconductor material layer such that the remaining source/drain metallization is disposed over said patterned gate conductor by at least said selected overlap distance.

Claim 7

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate; depositing a second gate conductor layer over said first gate conductor layer, said second conductor being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self-aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; depositing a substantially conformal dielectric layer over said patterned gate conductor and exposed portions of said substrate upper surface; depositing a substantially conformal layer of semiconductor material over said dielectric layer; depositing a layer of source/drain metallization over said semiconductor material layer; forming a planarization layer of a planarization material over the source/drain metallization, said planarization layer having a substantially planar exposed surface; uniformly removing said planarization material until said source/drain metallization is exposed in alignment with raised portions of said second gate conductor layer; and selectively removing the exposed source/drain metallization to expose the underlying semiconductor material layer such that the remaining source/drain metallization is disposed over said patterned gate conductor by at least said selected overlap distance.

Claim 15

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate, said first gate layer being transmissive of at least one frequency of radiation capable of exposing photoresist; depositing a second gate conductor layer over said first gate conductor layer, said second conductor layer being opaque to said at least one frequency of radiation and being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self-aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; depositing a first substantially conformal dielectric layer over said patterned gate conductor and exposed portions of said substrate upper surface; depositing a substantially conformal layer of semiconductor material on said dielectric layer; depositing a second layer of photoresist on the second dielectric layer; exposing a back-side substrate surface, opposite to said major substrate surface, to UV light for a selected duration, to cause exposure of at least a portion of the second photoresist layer outside of a shadow of the opaque portion of said gate electrode; removing at least the exposed second photoresist portion by selective development, to form a mask for etching the second dielectric layer; etching said second dielectric layer to remove the portions not protected by the retained portion of said second photoresist; depositing a layer of doped semiconductor material on the exposed semiconductor portion and over the remaining portion of the second dielectric layer; depositing a layer of source/drain metallization over said doped semiconductor material layer; forming a planarization layer of a planarization material over the source/drain metallization, said planarization layer having a substantially planar exposed surface; uniformly removing said planarization material until said source/drain metallization is exposed in alignment with raised portions of said patterned gate conductor; and selectively etching the exposed portion of the source/drain metallization and a portion of the doped semiconductor layer, to expose at least a top surface of the remaining portion of said second dielectric layer, and to form self-registered source and drain electrodes each of which overlaps the gate electrode at least by said selected overlap distance.

Claim 16

A method of fabricating a thin film transistor comprising the steps of: depositing a first gate conductor layer on a major surface of a substrate, said first gate layer being transmissive of at least one frequency of radiation capable of exposing photoresist; depositing a second gate conductor layer over said first gate conductor layer, said second conductor layer being opaque to said at least one frequency of radiation and being susceptible to etching under conditions under which said first gate conductor layer is substantially immune to etching; providing a photoresist layer over said second gate conductor layer; exposing and developing said photoresist in a pattern in accordance with a desired configuration of said first gate conductor layer; etching said second gate conductor layer and said first gate conductor layer where they are not protected by the retained portion of said photoresist layer; then etching back, with an etchant to which said first gate conductor layer is substantially immune, said second gate conductor layer to expose peripheral portions of said first gate conductor layer in a self-aligned manner so as to form a patterned gate electrode having a gate conductor topology wherein said second gate conductor layer has sloped sidewalls set back a selected overlap distance from sidewalls of said first gate conductor layer, said selected overlap distance corresponding to the exposed peripheral portions of said first gate conductor layer; depositing a first substantially conformal dielectric layer over said patterned gate conductor and exposed portions of said substrate upper surface; depositing a substantially conformal layer of semiconductor material on said dielectric layer; depositing a second layer of photoresist on the second dielectric layer; exposing a back-side substrate surface, opposite to said major substrate surface, to UV light for a selected duration, to cause exposure of at least a portion of the second photoresist layer outside of a shadow of the opaque portion of said gate electrode; removing at least the exposed second photoresist portion by selective development, to form a mask for etching the second dielectric layer; etching said second dielectric layer to remove the portions not protected by the retained portion of said second photoresist; depositing a layer of doped semiconductor material on the exposed semiconductor portion and over the remaining portion of the second dielectric layer; depositing a layer of source/drain metallization over said doped semiconductor material layer; forming a planarization layer of a planarization material over the source/drain metallization, said planarization layer having a substantially planar exposed surface; uniformly removing said planarization material until said source/drain metallization is exposed in alignment with raised portions of said patterned gate conductor; and selectively etching the exposed portion of the source/drain metallization and a portion of the doped semiconductor layer, to expose at least a top surface of the remaining portion of said second dielectric layer, and to form self-registered source and drain electrodes each of which overlaps the gate electrode at least by said selected overlap distance.