US5156716A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for the manufacture of a three layer tape for tape automated bonding
Assignee: Olin Corp
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Filing: 1991-04-26
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Granted: 1992-10-20
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Expires: 2011-04-26
Abstract
Abstract A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.
Inventors
- 👤 Arvind Parthasarathi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 07:53
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/002; H05K3/40; H05K3/4092; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/453; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09009; H05K2201/09063; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1545; H05K3/0041; H05K3/38; H05K3/386; H05K3/46; H05K3/4644; H05K3/4652
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
45 words
A process for the manufacture of a circuit, comprising the steps of: a) etching a plurality of apertures in a non-conductive substrate; b) depositing an adhesive on said non-conductive substrate; and c) bonding a conductive foil to said non-conductive substrate by means of said adhesive.
Claim 2
Dependent Claim
45 words
A process for the manufacture of a circuit, comprising the steps of: a) etching a plurality of apertures in a non-conductive substrate; b) depositing an adhesive on said non-conductive substrate; and c) bonding a conductive foil to said non-conductive substrate by means of said adhesive.
Claim 3
Dependent Claim
24 words
The process of claim 1 wherein said non-conductive substrate is selected from the group consisting of polyester, polycarbonate, polyimide, glass-filled epoxy, polyvinylchloride and polyethersulfone.
Claim 4
Dependent Claim
15 words
The process of claim 2 wherein said non-conductive substrate is selected to be a polyimide.
Claim 5
Dependent Claim
30 words
The process of claim 2 wherein said plurality of apertures comprises two rows of parallel holes running along the transverse edges of said non-conductive substrate and centrally positioned personality windows.
Claim 6
Dependent Claim
20 words
The process of claim 4 wherein the thickness of said non-conductive substrate is from about 2 to about 5 mils.
Claim 7
Dependent Claim
15 words
The process of claim 4 wherein said plurality of apertures are formed by chemical etching.
Claim 8
Dependent Claim
25 words
The process of claim 6 wherein said chemical etch is a liquid selected from the group consisting of potassium hydroxide, sodium hydroxide and ammonium hydroxide.
Claim 9
Dependent Claim
19 words
The process of claim 7 wherein said etching solution is potassium hydroxide and said non-conductive substrate is a polyimide.
Claim 10
Dependent Claim
26 words
The process of claim 6 wherein said etch is a plasma gas selected from the group consisting of O 2 and O 2 /CF 4 .
Claim 11
Dependent Claim
32 words
The process of claim 6 wherein said adhesive is deposited on said non-conductive substrate by a means selected from the group consisting of screen printing, spray coating, roller coating and dip coating.
Claim 12
Dependent Claim
13 words
The method of claim 10 wherein said adhesive is deposited by screen coating.
Claim 13
Dependent Claim
61 words
The process of claim 11 wherein said adhesive is selectively deposited over the entire central surface of said non-conductive substrate up to a distance from said parallel rows of apertures and from said personality windows effective to prevent migration of said adhesive into said parallel rows of apertures and personality windows during bonding of said conductive foil to said deposited adhesive.
Claim 14
Dependent Claim
27 words
The process of claim 12 wherein said adhesive extends to from about 0.5 to about 2 mils of said parallel rows of apertures and said personality windows.
Claim 15
Dependent Claim
34 words
The process of claim 13 wherein said conductive foil is laminated to said non-conductive substrate by bonding to said adhesive, the width of said conductive foil being defined by the width of said adhesive.
Claim 16
Dependent Claim
13 words
The process of claim 6 wherein said adhesive is deposited by spray coating.
Claim 17
Dependent Claim
21 words
The process of claim 15 further including a backing means to recover and remove adhesive deposited in said plurality of apertures.
Claim 18
Dependent Claim
24 words
The process of claim 16 wherein said backing means is selected from the group consisting of paper, waxed paper, polymer films and metallic foil.
Claim 19
Dependent Claim
30 words
The process of claim 17 wherein said backing means is selected to be a metallic foil which is non-reactive in a solvent suitable for dissolving said adhesive prior to polymerization.
Claim 20
Dependent Claim
21 words
The process of claim 18 wherein said backing means is selected to be copper and said suitable solvent is isopropyl alcohol.
Claim 21
Dependent Claim
47 words
The process of claim 6 wherein said non-conductive substrate is selected to be a polyimide, said adhesive is selected to be phenolic butyral and said conductive foil is selected to be copper or a copper based alloy, said conductive foil patterned into a plurality of circuit traces.
References Cited (Backward Citations)
US2893315A
Cited
US3301730A
Cited
US3437522A
Cited
US3448516A
Cited
US3480836A
Cited
US4087300A
Cited
USRE31967E
Cited
US4354895A
Cited
US4694572A
Cited
US4982495A
Cited
US5065228A
Cited
US5025114A
Cited
US4997517A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-20 | 1996-04-20 | 1996-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-20 | 2000-04-20 | 2000-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-20 | 2004-04-20 | 2004-10-20 | $7700.00 | Window Closed / Lapsed |