Abstract A process for producing a cheap carrier tape of a two layer structure having a superior heat resistance, difficultly susceptible of effect of impurities and having a superior flexibility is provided, which process comprising the following steps: coating a polyimide varnish onto a continuous, electrically-conductive metal foil and baking it; punching the resulting tape of a two layer structure of the metal foil and the polyimide film to form sprocket holes; cutting and removing the polyimide film to form a device hole; coating a resist onto the metal foil surface; light-exposing the resulting resist by the medium of a mask for separating a circuit pattern and a circuit from the sprocket parts; developing the resulting resist and etching the metal foil by the medium of a mask of the resist; removing the resist; and plating the metal foil.
A process for producing a carrier tape which comprises the steps of (a) coating a polyimide varnish onto one surface of a continuous, electrically-conductive metal foil, followed by baking the thus coated foil; (b) punching the resulting tape comprising a two layer structure consisting of said metal foil and polyimide film to form sprocket holes; (c) cutting and removing a portion of said polyimide film by means of a cutting-processing machine to thereby form a device hole; (d) coating a resist onto the other surface of said metal foil; (e) subjecting the resulting resist to light-exposure by the medium of a mask for separating a circuit pattern and a circuit from said sprocket holes; (f) subjecting the resulting resist to a developing treatment and etching said metal foil by the medium of a mask of said resist; (g) removing said resist; and (h) plating the resulting metal foil.
Claim 2
Dependent Claim
148 words
A process for producing a carrier tape which comprises the steps of (a) coating a polyimide varnish onto one surface of a continuous, electrically-conductive metal foil, followed by baking the thus coated foil; (b) punching the resulting tape comprising a two layer structure consisting of said metal foil and polyimide film to form sprocket holes; (c) cutting and removing a portion of said polyimide film by means of a cutting-processing machine to thereby form a device hole; (d) coating a resist onto the other surface of said metal foil; (e) subjecting the resulting resist to light-exposure by the medium of a mask for separating a circuit pattern and a circuit from said sprocket holes; (f) subjecting the resulting resist to a developing treatment and etching said metal foil by the medium of a mask of said resist; (g) removing said resist; and (h) plating the resulting metal foil.