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US5104604A
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Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
Assignee: Henkel Loctite Corp
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Filing: 1990-09-28
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Granted: 1992-04-14
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Expires: 2010-09-28
Abstract
Abstract A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony peroxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulate the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.
Inventors
- 👤 Anthony A. Gallo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 07:32
CPC Classifications
C; C08; C08L; C08L63/00; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/22; C08G59/30; C08K; C08K13/00; C08K13/02; C08K3/00; C08K3/18; C08K3/20; C08K3/22; C08K3/2279; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
244 words
A method for encapsulating a semiconductor device, said method comprising the steps of: (1) heating a thermosetting epoxy molding compound to a liquid state, and (2) encapsulating a semiconductor device with said thermosetting epoxy molding compound heated to a liquid state, and (3) cooling said encapsulated semiconductor device wherein said epoxy molding comprises: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 4-20 percent by weight of compound of a phenol-derived or a substituted phenol derived resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 10% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) from about 0.40 to about 0.80% antimony pentoxide by weight of molding compound; (2) from about 0.01-1.0 percent sodium by weight of antimony pentoxide compound; (3) a reactive organic compound containing at least about 0.5% of bromine by weight of molding compound which may include one or more of the other components; and (4) from about 0.02 to about 4.0% magnesium aluminum carbonate hydrate by weight of molding compound.
Claim 2
Independent Claim
244 words
A method for encapsulating a semiconductor device, said method comprising the steps of: (1) heating a thermosetting epoxy molding compound to a liquid state, and (2) encapsulating a semiconductor device with said thermosetting epoxy molding compound heated to a liquid state, and (3) cooling said encapsulated semiconductor device wherein said epoxy molding comprises: (a) about 5-25 percent by weight of compound of an epoxy; (b) about 4-20 percent by weight of compound of a phenol-derived or a substituted phenol derived resin hardener; (c) an effective amount of a catalyst for the reaction between said epoxy resin and said hardener in an amount of from about 0.1 to 10% by weight of the combined weight of epoxy and hardener; (d) an effective amount of a mold release agent for the release of the cured molding compound from a mold in an amount of between about 0.01 and about 2 percent by weight of compound; (e) between about 50 and 85 percent by weight of compound of a filler; and (f) a flame retardant system of: (1) from about 0.40 to about 0.80% antimony pentoxide by weight of molding compound; (2) from about 0.01-1.0 percent sodium by weight of antimony pentoxide compound; (3) a reactive organic compound containing at least about 0.5% of bromine by weight of molding compound which may include one or more of the other components; and (4) from about 0.02 to about 4.0% magnesium aluminum carbonate hydrate by weight of molding compound.
Claim 3
Dependent Claim
19 words
The method of claim 1, wherein said epoxy is about 10-17 percent by weight of the epoxy molding compound.
Claim 4
Dependent Claim
12 words
The method of claim 1 wherein said hardener is a phenolic novolac.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said hardener is an anhydride.
Claim 6
Dependent Claim
31 words
The method of claim 1 wherein said hardener is a polyanhydride of a maleic monomer and at least one alkyl styrene monomer or prepolymer of the polyanyhydride and the epoxy resin.
Claim 7
Dependent Claim
21 words
The method of claim 1 wherein said epoxy molding compound comprises at least about 50 weight percent of an inorganic filler.
Claim 8
Dependent Claim
11 words
The method of claim 1 wherein said inorganic filler includes silica.
Claim 9
Dependent Claim
20 words
The method of claim 1 wherein said epoxy molding compound comprises between about 60 and about 80 weight percent silica.
Claim 10
Dependent Claim
15 words
The method of claim 1 wherein said epoxy molding compound includes a silane coupling agent.
Claim 11
Dependent Claim
14 words
The method according to claim 1 wherein said epoxy molding compound includes a colorant.
Claim 12
Dependent Claim
15 words
The method of claim 1 wherein said reactive bromine-containing organic compound is a bromophenol-formaldehyde novolac.
Claim 13
Dependent Claim
18 words
The method of claim 1 wherein said reactive bromine-containing organic compound is a polyglycidyl ether of bromophenol-formaldehyde novolac.
Claim 14
Dependent Claim
17 words
The method according to claim 1, wherein said reactive bromine-containing organic compound is a bromophenol epoxy novolac.
Claim 15
Dependent Claim
18 words
The method according to claim 1, wherein said reactive bromine-containing organic compound is a meta-brominated cresol epoxy novolac.
Claim 16
Dependent Claim
16 words
The method according to claim 1, wherein said bromine-containing organic compound is part of said epoxy.
Claim 17
Dependent Claim
21 words
The method according to claim 1, wherein said bromine-containing organic compound is part of said phenol-derived or substituted phenol-derived resin hardener.
Claim 18
Dependent Claim
23 words
The method according to claim 1, wherein said reactive organic compound containing about 0.5-5.4 percent of bromine by weight of the molding compound.
Claim 19
Dependent Claim
23 words
The method according to claim 1, wherein said reactive organic compound containing about 0.5-2.2 percent of bromine by weight of the molding compound.
Claim 20
Dependent Claim
23 words
The method according to claim 1, wherein said reactive organic compound containing about 0.5-1.8 percent of bromine by weight of the molding compound.
Claim 21
Dependent Claim
24 words
The method according to claim 1, wherein the said flame retardant system contains about 0.03-0.06 percent of sodium by weight of the antimony pentoxide.
Claim 22
Dependent Claim
27 words
The method according to claim 1, wherein the said flame retardant system contains about 0.02-3.20 percent of magnesium aluminum carbonate hydrate by weight of the molding compound.
Claim 23
Dependent Claim
14 words
The method of claim 1 wherein said semiconductor device is a treated silicon wafer.
Claim 24
Dependent Claim
21 words
The method of claim 1 wherein said semiconductor device is selected from the group consisting of transistors, diodes and integrated circuits.
References Cited (Backward Citations)
US2879257A
Cited
US4024318A
Cited
US4127559A
Cited
USRE31214E
Cited
US3860523A
Cited
US3915926A
Cited
US3928277A
Cited
US3912792A
Cited
US3950456A
Cited
US3856890A
Cited
US3983185A
Cited
US3920459A
Cited
US4075154A
Cited
US4155949A
Cited
US4006114A
Cited
US4137212A
Cited
US4278581A
Cited
US4339556A
Cited
US4205142A
Cited
US4282136A
Cited
JPS57123249A
Cited
US4417018A
Cited
US4710531A
Cited
US4618636A
Cited
US4544688A
Cited
US4710796A
Cited
US4684721A
Cited
JPS61143464A
Cited
US4675356A
Cited
US4725638A
Cited
US4668719A
Cited
US4716184A
Cited
US4743044A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-14 | 1995-10-14 | 1996-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-14 | 1999-10-14 | 2000-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-14 | 2003-10-14 | 2004-04-14 | $7700.00 | Window Closed / Lapsed |