Patent US5027742A successfully refreshed from Google Patents.
Patent US5098630A successfully refreshed from Google Patents.
US5098630A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of molding a solid state image pickup device
Assignee: Olympus Corp
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Filing: 1989-08-21
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Granted: 1992-03-24
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Expires: 2009-08-21
Abstract
Abstract A solid-state image pickup device comprises a semiconductor chip, a package with a recess in which said semiconductor chip is fixed, and a transparent protective member for protecting an image pickup surface of the semiconductor chip and guiding a light image onto the image pickup surface. The transparent protective member includes a transparent resin layer for covering the image pickup surface and the upper surface of the package without forming a space therebetween, and an incident surface formed on the resin layer in parallel to the image pickup surface. A method manufactures a solid-state image pickup device having a construction described above by using a mold.
Inventors
- 👤 Hisao Ogiu
- 👤 Takeji Takagi
- 👤 Toshio Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:58
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; B; B29; B29C; B29C70/00; B29C70/68; B29C70/78; H04; H04N; H04N23/00; H04N23/50; H04N23/555; B29C39/00; B29K; B29K2995/00; B29K2995/0018; B29K2995/0026; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
247 words
A method of manufacturing a solid-state image pickup device, comprising the following steps are performed in the same sequence as stated: placing a package in a molding cavity of a mold member so that the package is mounted on the bottom surface of the cavity, said package having a semiconductor chip mounted on the upper surface thereof and lead legs downwardly extended therefrom, with the lead legs being inserted in holes formed in the bottom surface of the cavity, and an image pickup surface of the semiconductor chip being directed toward an opening formed in a top surface of the mold member and being parallel with the top surface; pouring a transparent resin in a fluid state into the molding cavity so that substantially the entire upper surface of the resin extends upward from the top surface of the mold member through said opening; mounting a forming member onto the top surface of the mold member so that a flat under surface of the forming member removes the upwardly extended portion of the resin and contacts the top surface of the mold member to cover the opening, whereby the under surface of the forming member contacts the resin and is parallel to the image pickup surface of said semiconductor chip placed in the molding cavity; curing the transparent resin in the fluid state; and releasing said forming member and package from the mold member, and said forming member from the cured transparent resin, after the curing step.
Claim 2
Independent Claim
247 words
A method of manufacturing a solid-state image pickup device, comprising the following steps are performed in the same sequence as stated: placing a package in a molding cavity of a mold member so that the package is mounted on the bottom surface of the cavity, said package having a semiconductor chip mounted on the upper surface thereof and lead legs downwardly extended therefrom, with the lead legs being inserted in holes formed in the bottom surface of the cavity, and an image pickup surface of the semiconductor chip being directed toward an opening formed in a top surface of the mold member and being parallel with the top surface; pouring a transparent resin in a fluid state into the molding cavity so that substantially the entire upper surface of the resin extends upward from the top surface of the mold member through said opening; mounting a forming member onto the top surface of the mold member so that a flat under surface of the forming member removes the upwardly extended portion of the resin and contacts the top surface of the mold member to cover the opening, whereby the under surface of the forming member contacts the resin and is parallel to the image pickup surface of said semiconductor chip placed in the molding cavity; curing the transparent resin in the fluid state; and releasing said forming member and package from the mold member, and said forming member from the cured transparent resin, after the curing step.
Claim 3
Dependent Claim
111 words
The method according to claim 1, wherein said mold member comprises a base having an upper surface constituting said bottom surface of the mold cavity, a pair of mold halves removably mounted on the upper surface of the base, each mold half including an end face and a recess formed in the end face so that when the mold halves are combined with each other and with the base, the end faces of the mold halves contact each other so that the recesses of the mold halves form said mold cavity together with the upper surface of the base, and fixing means for fixing the mold halves to the base thereon.
Claim 4
Dependent Claim
50 words
The method according to claim 2 wherein said releasing step includes a step of moving the mold halves along the upper surface of the base so that they are removed from the cured synthetic resin and package, and a step of removing the forming means from the cured synthetic resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-24 | 1995-09-23 | 1996-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-24 | 1999-09-23 | 2000-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-24 | 2003-09-23 | 2004-03-24 | $7700.00 | Window Closed / Lapsed |