US4746392A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing an identification card with an integrated circuit
Assignee: GAO Gesellschaft fuer Automation und Organisation mbH
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Filing: 1986-09-22
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Granted: 1988-05-24
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Expires: 2006-09-22
Abstract
Abstract A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.
Inventors
- 👤 Joachim Hoppe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:16
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/0772; G06K19/07728; H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
195 words
A method of producing an identification card including an IC module comprising the steps of: (a) providing an IC module mounted on a carrier element; (b) providing at least one identification card layer with a recess layer in dimension than said IC module; (c) suspending said IC module within said recess so that empty space exists substantially completely around said IC module in said recess; and (d) introducing an amount of polymer material having a consistency which ranges from pasty to liquid and being capable of cross-linking to form a solid elastomeric material into said recess so as to fill said empty space around said IC module thereby resulting with a completely encased IC module; prior to (e) applying a cover film to said identification card layer; and (f) subjecting such cover film and at least one identification card layer to laminating heat and pressure to form a laminated identification card layer construction and to permit said polymer to cross-link only during or after the laminating process and form into a solid elastomeric material whereby an identification card is produced having substantially flat surfaces essentially devoid of deformations in the area of the IC module.
Claim 2
Independent Claim
195 words
A method of producing an identification card including an IC module comprising the steps of: (a) providing an IC module mounted on a carrier element; (b) providing at least one identification card layer with a recess layer in dimension than said IC module; (c) suspending said IC module within said recess so that empty space exists substantially completely around said IC module in said recess; and (d) introducing an amount of polymer material having a consistency which ranges from pasty to liquid and being capable of cross-linking to form a solid elastomeric material into said recess so as to fill said empty space around said IC module thereby resulting with a completely encased IC module; prior to (e) applying a cover film to said identification card layer; and (f) subjecting such cover film and at least one identification card layer to laminating heat and pressure to form a laminated identification card layer construction and to permit said polymer to cross-link only during or after the laminating process and form into a solid elastomeric material whereby an identification card is produced having substantially flat surfaces essentially devoid of deformations in the area of the IC module.
Claim 3
Dependent Claim
32 words
The method in accordance with claim 1 further comprising providing a cavity remote from said recess and a channel in communication between said cavity and said recess within said layer of construction.
Claim 4
Dependent Claim
46 words
The method in accordance with claim 2 wherein said at least one card layer comprises a first layer and a second layer, said recess being formed in said first layer and said second layer and said cavity and said channel being formed in said second layer.
Claim 5
Dependent Claim
25 words
The method in accordance with claim 1 further comprising providing said cover film with a magnetic strip located in the area of said IC module.
Claim 6
Dependent Claim
15 words
The method in accordance with claim 1 wherein said polymer is a silicon rubber composition.
References Cited (Backward Citations)
US3206647A
Cited
US3622419A
Cited
US3702464A
Cited
DE2220721A1
Cited
US3778685A
Cited
US4216577A
Cited
DE2734439A1
Cited
US4079511A
Cited
US4417413A
Cited
US4474292A
Cited
GB2081950A
Cited
DE3029939A1
Cited
GB2081644A
Cited
GB2090466A
Cited
US4460825A
Cited
JPS5821850A
Cited
JPS5895844A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-24 | 1991-11-23 | 1992-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-24 | 1995-11-23 | 1996-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-24 | 1999-11-23 | 2000-05-24 | $7700.00 | Window Closed / Lapsed |