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US3367025A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating and plastic encapsulating a semiconductor device

Assignee: Motorola Solutions Inc
•
Filing: 1966-11-04
•
Granted: 1968-02-06
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Expires: 1986-11-04
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Abstract

No abstract record available.

Inventors

  • 👤 George A Doyle

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 13:28
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49172; Y10T29/53; Y10T29/5313

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

US1626118A Cited
US2794211A Cited
US2720617A Cited
US2876499A Cited
US2888736A Cited
US3117349A Cited
US3092522A Cited
US3084391A Cited
US3187240A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1971-02-05 1971-08-07 1972-02-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1975-02-05 1975-08-07 1976-02-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1979-02-05 1979-08-07 1980-02-06 $7700.00 Window Closed / Lapsed

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