Patent US3367025A successfully refreshed from Google Patents.
US3367025A
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Method for fabricating and plastic encapsulating a semiconductor device
Assignee: Motorola Solutions Inc
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Filing: 1966-11-04
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Granted: 1968-02-06
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Expires: 1986-11-04
Abstract
No abstract record available.
Inventors
- 👤 George A Doyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:52
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49172; Y10T29/53; Y10T29/5313
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
US1626118A
Cited
US2794211A
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US2720617A
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US2876499A
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US2888736A
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US3117349A
Cited
US3092522A
Cited
US3084391A
Cited
US3187240A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-02-05 | 1971-08-07 | 1972-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-02-05 | 1975-08-07 | 1976-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-02-05 | 1979-08-07 | 1980-02-06 | $7700.00 | Window Closed / Lapsed |