USH445H
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming light emitting device with direct contact lens
Assignee: AT&T Inc
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Filing: 1985-11-29
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Granted: 1988-03-01
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Expires: 2005-11-29
Abstract
Abstract A method of forming a direct contact lens on a light emitting device strure is disclosed which facilitates the formation of large arrays of light emitting devices. The method uses a printing fixture including a large number of vertically oriented pins which is dipped into a bath of a liquid epoxy material. The printing fixture is then placed over the array structures and lowered until the pins contact the diodes. When the printing fixture is subsequently raised, the lens material will adhere to the associated devices and flow to completely encapsulate the device and a substantial portion of the device mounting structure.
Inventors
- 👤 Anne B. Bock
- 👤 Samuel E. Kurtz
- 👤 Thomas E. Seibert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 07:31
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
150 words
A method of forming a direct contact lens on a semiconductor light emitting device assembly comprising the steps of: a. lowering a deposition apparatus including a downwardly extending vertical pin into a path of a liquid lens material; b. removing said deposition apparatus from said bath so that a drop of lens material adheres to said vertical pin; c. lowering said deposition apparatus over said semiconductor light emitting device so that said drop of lens material contacts a top portion of said semiconductor light emitting device; d. raising said deposition apparatus in a manner such that said drop of lens material adheres to said device and flows to substantially cover both said device and a mounting structure holding said device to form the direct contact lens for said semiconductor light emitting device; and e. curing said light emitting device assembly to harden the direct contact lens in its final form.
Claim 2
Independent Claim
150 words
A method of forming a direct contact lens on a semiconductor light emitting device assembly comprising the steps of: a. lowering a deposition apparatus including a downwardly extending vertical pin into a path of a liquid lens material; b. removing said deposition apparatus from said bath so that a drop of lens material adheres to said vertical pin; c. lowering said deposition apparatus over said semiconductor light emitting device so that said drop of lens material contacts a top portion of said semiconductor light emitting device; d. raising said deposition apparatus in a manner such that said drop of lens material adheres to said device and flows to substantially cover both said device and a mounting structure holding said device to form the direct contact lens for said semiconductor light emitting device; and e. curing said light emitting device assembly to harden the direct contact lens in its final form.
Claim 3
Dependent Claim
46 words
The method of claim 1 in which the vertical pin comprises a tapered tip section so as to allow a sufficient amount of lens material to adhere to said vertical pin to provide substantial coverage of both the semiconductor light emitting device and the mounting structure.
Claim 4
Dependent Claim
24 words
The method of claim 1 wherein the bath of liquid lens material comprises a liquid epoxy material with a refractive index greater than 1.
Claim 5
Independent Claim
166 words
A method of forming a plurality of lenses on an associated plurality of semiconductor light emitting devices included in a device assembly, the method comprising the steps of: a. lowering a deposition assembly including a plurality of downwardly extending vertical pins into a bath of liquid lens material; b. removing said deposition assembly from said bath so that a drop of lens material adheres to each pin of said plurality of downwardly extending vertical pins; c. lowering said printing structure over said plurality of semiconductor light emitting devices so that each drop of lens material contacts a separate one of said plurality of semiconductor light emitting devices; d. raising said deposition assembly in a manner such that each drop of lens material adheres to its associated semiconductor light emitting device and flows to substantially encapsulate the semiconductor light emitting device and a portion of an associated mounting structure; and e. curing said light emitting device assembly to harden said plurality of lenses in their final form.
Claim 6
Independent Claim
166 words
A method of forming a plurality of lenses on an associated plurality of semiconductor light emitting devices included in a device assembly, the method comprising the steps of: a. lowering a deposition assembly including a plurality of downwardly extending vertical pins into a bath of liquid lens material; b. removing said deposition assembly from said bath so that a drop of lens material adheres to each pin of said plurality of downwardly extending vertical pins; c. lowering said printing structure over said plurality of semiconductor light emitting devices so that each drop of lens material contacts a separate one of said plurality of semiconductor light emitting devices; d. raising said deposition assembly in a manner such that each drop of lens material adheres to its associated semiconductor light emitting device and flows to substantially encapsulate the semiconductor light emitting device and a portion of an associated mounting structure; and e. curing said light emitting device assembly to harden said plurality of lenses in their final form.
Claim 7
Dependent Claim
18 words
The method of claim 4 wherein the plurality of light emitting devices is arranged in an array configuration.
Claim 8
Dependent Claim
21 words
The method of claim 4 wherein each pin of the plurality of downward extending vertical pins comprises a tapered tip section.
Claim 9
Dependent Claim
22 words
The method of claim 4 wherein the liquid lens material comprises a liquid epoxy material with a refractive index greater than 1.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-01 | 1991-08-31 | 1992-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-01 | 1995-08-31 | 1996-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-01 | 1999-08-31 | 2000-03-01 | $7700.00 | Window Closed / Lapsed |