US3935501A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Micro-miniature light source assemblage and mounting means therefor
Assignee: DIGITAL COMPONENTS CORP
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Filing: 1975-02-13
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Granted: 1976-01-27
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Expires: 1995-02-13
Abstract
Abstract A micro-miniature light source assemblage is provided having enhanced mechanical strength, maximum light output, and versatile accommodation for other integrated circuit components by employing as mounting for the LED (light emitting diode) a preassemblage of electric leads having an overlapped and insulated bond which is durable and permits flexibility in the orientation of said leads in use. The preassemblage of leads can also provide for mounting of other solid state devices, and special adaptations include offset and/or reduced thickness portions of said leads at the bond area as well as a modification in which an integral extension of one lead forms the electrical connection to an LED or other device mounted on the other lead.
Inventors
- 👤 Silvester Sterbal
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 05:37
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; C; C08; C08F; C08F10/00; H10H; H10H20/00; H10H20/80; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
122 words
A micro-miniature electrical assemblage comprising a pair of wire leads having overlapped ends, said ends, at the overlapped positions only thereof, being joined by bonding means providing both electrical insulation and physical strength, thereby forming a sub-assemblage having a central bonded juncture with the leads divergently projecting therefrom and freely deformable with respect thereto, a solid state electrical component having top and bottom contacts, said component being joined at the bottom thereof to one of said leads by electrically conductive bonding means, fine wire means electrically bonded to the top of said component and to the other of said leads, and said bonded juncture and associated solid state component being enveloped by a hardened mass of plastic material having electrical insulating properties.
Claim 2
Dependent Claim
122 words
A micro-miniature electrical assemblage comprising a pair of wire leads having overlapped ends, said ends, at the overlapped positions only thereof, being joined by bonding means providing both electrical insulation and physical strength, thereby forming a sub-assemblage having a central bonded juncture with the leads divergently projecting therefrom and freely deformable with respect thereto, a solid state electrical component having top and bottom contacts, said component being joined at the bottom thereof to one of said leads by electrically conductive bonding means, fine wire means electrically bonded to the top of said component and to the other of said leads, and said bonded juncture and associated solid state component being enveloped by a hardened mass of plastic material having electrical insulating properties.
Claim 3
Dependent Claim
51 words
A micro-miniature electrical assemblage as defined in claim 1, wherein said solid state electrical component is a light emitting diode (LED) device, and said plastic material is clear and of lens-like contour to thereby enhance light emission of said device in a direction perpendicularly to the plane of said bonded juncture.
Claim 4
Dependent Claim
17 words
A micro-miniature electrical assemblage as defined in claim 1, wherein said leads are of flat, ribbon-like contour.
Claim 5
Dependent Claim
35 words
A micro-miniature electrical assemblage as defined in claim 3, wherein at least one of said leads is offset adjacent the point of juncture to dispose the major portion of said leads in a common plane.
Claim 6
Dependent Claim
70 words
A micro-miniature electrical assemblage as defined in claim 3, wherein the juncture portion of one of said leads comprises transversely spaced tabs for bonding with said other lead, and said first lead having an integral fine extension between and extending beyond said tabs, and said extension providing the fine wire means for completing electrical circuit to the top of a solid state electrical component electrically bonded to said other lead.
Claim 7
Dependent Claim
35 words
A micro-miniature electrical assemblage as defined in claim 3, wherein said solid state electrical component is mounted over the juncture of said leads to thereby minimize the dimension of said assemblage longitudinally of said leads.
Claim 8
Dependent Claim
37 words
A micro-miniature electrical assemblage as defined in claim 3, wherein said solid state electrical component is mounted on one of said leads adjacent said juncture to thereby minimize the dimensions of said assemblage perpendicularly to said leads.
Claim 9
Dependent Claim
27 words
A micro-miniature electrical assemblage as defined in claim 3, wherein a second electrical component is included in said assemblage in circuit with said solid state electrical component.
Claim 10
Dependent Claim
29 words
A micro-miniature electrical assemblage as defined in claim 8, wherein said second component has a bottom contact and is bonded to one of said leads by electrically conductive means.
Claim 11
Dependent Claim
29 words
A micro-miniature electrical assemblage as defined in claim 8, wherein said second component has no bottom contact and is bonded to one of said leads by electrically insulating means.
Claim 12
Dependent Claim
41 words
A micro-miniature electrical assemblage as defined in claim 3, wherein said hardened mass of plastic material extends only slightly beyond the width of said ribbon-like leads to thereby permit the close packing of a plurality of said assemblages in side-by-side arrangement.
Claim 13
Dependent Claim
59 words
A micro-miniature electrical assemblage as defined in claim 1, wherein said leads are wires of circular cross section, and end portions thereof are flattened to provide juncture areas which are substantially thinner and substantially wider than the wire diameter, and said solid state electrical component being joined to one of said flattened portions by said electrically conductive bonding means.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-01-26 | 1979-07-28 | 1980-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-01-26 | 1983-07-28 | 1984-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-01-26 | 1987-07-28 | 1988-01-27 | $7700.00 | Window Closed / Lapsed |