Hybridized monolithic array package

Claim 2

The package recited in claim 1 further defined by a member extending from a wall of each cavity to support the first lead.

Claim 3

The package recited in claim 1 wherein the housing comprises a dielectric material.

Claim 4

The package recited in claim 4 wherein the housing comprises molded plastic.

Claim 5

The structure recited in claim 1 wherein the die is bonded to the first lead.

Claim 6

The structure recited in claim 1 wherein the protective layer comprises a thermosetting liquid encapsulant cured into a rigid, scratch- and solvent-resistant surface.

Claim 7

The structure as defined in claim 6 wherein the encapsulant is selected from a group consisting of a clear thermosetting liquid acrylic, polyester, epoxy, or a combination thereof.

Claim 8

In a method of assembling a plurality of semiconductor dice into a package, the steps comprising: bonding each die to the first terminal lead in a corresponding pair of terminal leads of conductive material, a separate pair of terminal leads existing for each die, whereby the first lead supports the bonded die and makes electrical contact to a portion thereof; bonding a portion of a corresponding conductive wire to another portion of each die so that electrical contact is made thereto, a separate conductive wire existing for each die; testing each die via the respective first lead and wire for a desired photoresponse; inserting each pair of terminal leads to which is attached a die yielding the desired photoresponse into a corresponding one of a plurality of cavities located within a housing the first lead in each pair of terminal leads supporting a die having the desired photoresponse, each cavity extending to a selected external surface of the housing and formed so that terminal leads placed therein are kept electrically isolated, each terminal lead extending through the housing, each die being aligned so that light can be applied to a principal light-sensitive surface of the die; bonding another portion of each conductive wire to the second lead of the corresponding terminal lead pair so that electrical contact is made thereto; and filling each cavity with a transparent encapsulant that surrounds exposed portions of each die and its corresponding pair of terminal leads, the encapsulant extending to at least one selected external surface to render the latter substantially planar in shape.

Claim 9

The process recited in claim 9 wherein a plurality of light-sensitive dice are inserted into a respective plurality of cavities located within the housing, one die for each cavity, thereby forming a photoarray package comprising components having a desired photoresponse.