Ssembly process for semiconductor device
Abstract
Abstract 916,174. Semi-conductor devices. TEXAS INSTRUMENTS Inc. July 21, 1959 [July 25, 1958], No. 24981/59. Class 37. In a process for making a semi-conductor device a lead wire is bent into a closed straightsided loop with its ends in alignment and under compression, and a semi-conductor body inserted between its ends to form a self-supporting sub-assembly. In the embodiment a split loop 22 (Fig. 2) of tinned copper or silver wire is sprung open and a moulded nylon cup 18 threaded over one of its ends. A diffused junction silicon wafer 14 with nickel-plated faces is slipped between the ends of the loop which is then released to clamp the wafer in position. A number of such loops are then hung on a rack and after dipping in flux are dipped in molten solder to join the wafers to the ends of the loop. The joints are cleaned by successive etchings in a phosphate solution and nitric acid after which the nylon cups are slipped over the joints and filled with epoxy resin which is afterwards heathardened.
Inventors
- 👤 Peterson John Daniel
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1963-12-20 | 1964-06-20 | 1964-12-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1967-12-20 | 1968-06-20 | 1968-12-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1971-12-20 | 1972-06-20 | 1972-12-20 | $7700.00 | Window Closed / Lapsed |