Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
226 words
A semiconductor element, comprising: a semiconductor substrate containing at least a first high reverse blocking pn junction, said first pn junction being formed at a boundary of a heavily doped zone of a first conductivity type and a lightly doped zone of a second conductivity type; wherein: the heavily doped zone extends from a main surface of said semiconductor substrate inwards into the semiconductor substrate and is surrounded by the lightly doped zone; further comprising: a guard zone adjoining the heavily doped zone and forming a second pn junction at a boundary of said guard zone and the lightly doped zone, said second pn junction terminating at said main surface; wherein: a doping density of the guard zone decreases in a direction parallel to the main surface from the heavily doped zone towards the second pn junction; the guard zone has a maximum depth of penetration near the heavily doped zone; the maximum depth of penetration of the guard zone is greater than a depth of penetration of the heavily doped zone; the guard zone has a maximum doping density less than 10 15 cm -3 ; the guard zone has a width which is comparable with a thickness of the lightly doped zone; and the maximum depth of penetration of the guard zone is not less than 40 μm and not more than 80 μm.
Claim 2
Dependent Claim
226 words
A semiconductor element, comprising: a semiconductor substrate containing at least a first high reverse blocking pn junction, said first pn junction being formed at a boundary of a heavily doped zone of a first conductivity type and a lightly doped zone of a second conductivity type; wherein: the heavily doped zone extends from a main surface of said semiconductor substrate inwards into the semiconductor substrate and is surrounded by the lightly doped zone; further comprising: a guard zone adjoining the heavily doped zone and forming a second pn junction at a boundary of said guard zone and the lightly doped zone, said second pn junction terminating at said main surface; wherein: a doping density of the guard zone decreases in a direction parallel to the main surface from the heavily doped zone towards the second pn junction; the guard zone has a maximum depth of penetration near the heavily doped zone; the maximum depth of penetration of the guard zone is greater than a depth of penetration of the heavily doped zone; the guard zone has a maximum doping density less than 10 15 cm -3 ; the guard zone has a width which is comparable with a thickness of the lightly doped zone; and the maximum depth of penetration of the guard zone is not less than 40 μm and not more than 80 μm.
Claim 3
Dependent Claim
39 words
Semiconductor element according to claim 1, wherein the doping density of the heavily doped zone has a concentration less than 10 18 cm -3 and decreases sharply from said concentration to a maximum doping density of the guard zone.
Claim 4
Dependent Claim
38 words
Semiconductor element according to claim 1, wherein the doping density of the guard zone decreases in at least two steps and a first step extends into said semiconductor substrate about twice as deep as the heavily doped zone.
Claim 5
Dependent Claim
42 words
Semiconductor element according to claim 3, wherein the doping density of the guard zone decreases in precisely two steps and the doping density of a second step of the two steps is about half as great as that of a first step.
Claim 6
Dependent Claim
25 words
Semiconductor element according to claim 1, wherein the doping density of the guard zone decreases approximately linearly in the direction parallel to the main surface.
Claim 7
Dependent Claim
232 words
A semiconductor structure with a pn junction for use in a thyristor, comprising: a semiconductor substrate containing at least a first high reverse blocking pn junction, said first pn junction being formed between a boundary of a heavily doped zone of a first conductivity type and a lightly doped zone of a second conductivity type; wherein: the heavily doped zone extends from a main surface of said substrate inwards into the semiconductor substrate and is surrounded by the lightly doped zone; further comprising: a guard zone adjoining the heavily doped zone and forming a second pn junction at a boundary of said guard zone and the lightly doped zone, said second pn junction terminating at said main surface; wherein: a doping density of the guard zone decreases in a direction parallel to the main surface from the heavily doped zone towards the second pn junction; the guard zone has a maximum penetration depth near the heavily doped zone; the maximum depth of penetration of the guard is greater than a depth of penetration of the heavily doped zone; the guard zone has a maximum doping density less than 10 15 cm -3 ; the guard zone has a width which is comparable with a thickness of the lightly doped zone; and the maximum depth of penetration of the guard zone is not less than 40 μm and not more than 80 μm.
Claim 8
Dependent Claim
232 words
A semiconductor structure with a pn junction for use in a thyristor, comprising: a semiconductor substrate containing at least a first high reverse blocking pn junction, said first pn junction being formed between a boundary of a heavily doped zone of a first conductivity type and a lightly doped zone of a second conductivity type; wherein: the heavily doped zone extends from a main surface of said substrate inwards into the semiconductor substrate and is surrounded by the lightly doped zone; further comprising: a guard zone adjoining the heavily doped zone and forming a second pn junction at a boundary of said guard zone and the lightly doped zone, said second pn junction terminating at said main surface; wherein: a doping density of the guard zone decreases in a direction parallel to the main surface from the heavily doped zone towards the second pn junction; the guard zone has a maximum penetration depth near the heavily doped zone; the maximum depth of penetration of the guard is greater than a depth of penetration of the heavily doped zone; the guard zone has a maximum doping density less than 10 15 cm -3 ; the guard zone has a width which is comparable with a thickness of the lightly doped zone; and the maximum depth of penetration of the guard zone is not less than 40 μm and not more than 80 μm.
Claim 9
Dependent Claim
187 words
A semiconductor element comprising: a semiconductor substrate having a main surface; a first zone of a first conductivity type and first doping density extending from said main surface inwards into said semiconductor substrate; a second zone of a second conductivity type, predetermined thickness, and second doping density surrounding said first zone, wherein said first doping density is higher than said second doping density; a first pn junction formed between said first and second zones; a guard zone formed to adjoin said first zone and forming a second pn junction between said guard zone and said second zone, said guard zone having a predetermined doping density less then 1.10 15 cm -3 , a maximum depth of penetration and width; said doping density of said guard zone decreasing in a direction parallel to said main surface from said first zone towards said second pn junction; said maximum depth of penetration of said guard zone appearing near said first zone and being greater than a depth of penetration of the first zone; and said width of said guard zone being comparable to the predetermined thickness of the second zone.
Claim 10
Dependent Claim
187 words
A semiconductor element comprising: a semiconductor substrate having a main surface; a first zone of a first conductivity type and first doping density extending from said main surface inwards into said semiconductor substrate; a second zone of a second conductivity type, predetermined thickness, and second doping density surrounding said first zone, wherein said first doping density is higher than said second doping density; a first pn junction formed between said first and second zones; a guard zone formed to adjoin said first zone and forming a second pn junction between said guard zone and said second zone, said guard zone having a predetermined doping density less then 1.10 15 cm -3 , a maximum depth of penetration and width; said doping density of said guard zone decreasing in a direction parallel to said main surface from said first zone towards said second pn junction; said maximum depth of penetration of said guard zone appearing near said first zone and being greater than a depth of penetration of the first zone; and said width of said guard zone being comparable to the predetermined thickness of the second zone.
Claim 11
Dependent Claim
229 words
A semiconductor element comprising: a semiconductor substrate having a main surface; a first zone of a first conductivity type and first doping density extending from said main surface inwards into said semiconductor substrate; a second zone of a second conductivity type, predetermined thickness, and second doping density surrounding said first zone, wherein said first doping density is higher than said second doping density; a first pn junction formed between said first and second zones; a guard zone formed to adjoin said first zone and forming a second pn junction between said guard zone and said second zone, said guard zone having a predetermined doping density, maximum depth of penetration and width; said doping density of said guard zone decreasing in a direction parallel to said main surface from said first zone towards said second pn junction wherein the doping density of the guard zone decreases in precisely two steps with a first step extending inwards about twice as deep as the first zone and the doping density of a second step of the two steps is about half as great as that of a first step; said maximum depth of penetration of said guard zone appearing near said first zone and being greater than a depth of penetration of the first zone; and said width of said guard zone being comparable to the predetermined thickness of the second zone.
Claim 12
Dependent Claim
229 words
A semiconductor element comprising: a semiconductor substrate having a main surface; a first zone of a first conductivity type and first doping density extending from said main surface inwards into said semiconductor substrate; a second zone of a second conductivity type, predetermined thickness, and second doping density surrounding said first zone, wherein said first doping density is higher than said second doping density; a first pn junction formed between said first and second zones; a guard zone formed to adjoin said first zone and forming a second pn junction between said guard zone and said second zone, said guard zone having a predetermined doping density, maximum depth of penetration and width; said doping density of said guard zone decreasing in a direction parallel to said main surface from said first zone towards said second pn junction wherein the doping density of the guard zone decreases in precisely two steps with a first step extending inwards about twice as deep as the first zone and the doping density of a second step of the two steps is about half as great as that of a first step; said maximum depth of penetration of said guard zone appearing near said first zone and being greater than a depth of penetration of the first zone; and said width of said guard zone being comparable to the predetermined thickness of the second zone.