US5089878A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low impedance packaging
Assignee: Individual
•
Filing: 1989-06-09
•
Granted: 1992-02-18
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Expires: 2009-06-09
Abstract
Abstract A package for an integrated circuit is disclosed. The package includes a lead frame with an overlying dielectric layer. One or more conductive coupons are placed on the dielectric layer and act as multiple inductive paths for the power and ground lines. Decoupling capacitors may be attached between coupons.
Inventors
- 👤 Jaesup N. Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 21:37
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/501; H10W44/601; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W70/475; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/00; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
181 words
A low impedance integrated circuit package comprising: a) a lead frame, said lead frame comprising a die paddle and a plurality of leads, said die paddle and said plurality of leads lying in substantially a common plane; b) a first dielectric region above a first lead, wherein said first lead is chosen from said plurality of leads; c) a first conductive region above said first dielectric region; d) an electrical connection between a first end of said first lead and said first conductive region; e) an electrical connection between a second end of said first lead and said first conductive region; f) a second dielectric region above a second lead, wherein said second lead is chosen from said plurality of leads; g) a second conductive region above said second dielectric region; h) an electrical connection between a first end of said second lead and said second conductive region; i) an electrical connection between a second end of said second lead and said second conductive region; and j) a decoupling capacitor connected between said first conductive region and said second conductive region.
Claim 2
Dependent Claim
181 words
A low impedance integrated circuit package comprising: a) a lead frame, said lead frame comprising a die paddle and a plurality of leads, said die paddle and said plurality of leads lying in substantially a common plane; b) a first dielectric region above a first lead, wherein said first lead is chosen from said plurality of leads; c) a first conductive region above said first dielectric region; d) an electrical connection between a first end of said first lead and said first conductive region; e) an electrical connection between a second end of said first lead and said first conductive region; f) a second dielectric region above a second lead, wherein said second lead is chosen from said plurality of leads; g) a second conductive region above said second dielectric region; h) an electrical connection between a first end of said second lead and said second conductive region; i) an electrical connection between a second end of said second lead and said second conductive region; and j) a decoupling capacitor connected between said first conductive region and said second conductive region.
Claim 3
Dependent Claim
25 words
A low impedance package as recited in claim 4, wherein said first lead is a ground lead and said second lead is a power lead.
Claim 4
Dependent Claim
20 words
Apparatus as recited in claim 1, wherein said decoupling capacitor is mounted above said first and said second conductive regions.
Claim 5
Dependent Claim
20 words
A package as recited in claim 1, wherein said first dielectric region is selected from the group thermoplastic and polyimide.
Claim 6
Dependent Claim
16 words
A package as recited in claim 1, wherein said first conductive region is a copper strip.
Claim 7
Dependent Claim
16 words
A package as recited in claim 1, wherein said first conductive region is an aluminum strip.
Claim 8
Dependent Claim
35 words
A package as recited in c laim 4, wherein said second lead is a ground lead, said first lead is a power lead, and said first and second conductive regions are substantially trapezoidal in shape.
Claim 9
Dependent Claim
35 words
A package as recited in c laim 4, wherein said second lead is a ground lead, said first lead is a power lead, and said first and second conductive regions are substantially trapezoidal in shape.
Claim 10
Dependent Claim
44 words
A package as recited in claim 7 further comprising third and fourth leads, said third and fourth leads also having adjacent dielectric regions and third and fourth trapezoidal conductive regions, said first, second, third and fourth conductive regions forming a central, rectangular die opening.
Claim 11
Dependent Claim
21 words
A package as recited in claim 8 further comprising decoupling capacitors mounted between said first, second, third, and fourth conductive regions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-17 | 1995-08-19 | 1996-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-17 | 1999-08-19 | 2000-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-17 | 2003-08-19 | 2004-02-18 | $7700.00 | Window Closed / Lapsed |