Resin sealing semiconductor device

Abstract

Abstract PURPOSE:To increase strength of adhesion and bonding at the interface between a sealing resin and lead pins, by forming film of an epoxy resin on the outer surface of the lead pins. CONSTITUTION:Lead pins 5 and a tab 2 are formed in a lead frame. The tab 2 and soldering parts 3a are masked. Then, the lead frame is immersed in a liquid, in which 100pts.wt. of epoxy resin material as a main agent and 22pts. wt. of Epicure material T are mixed. The lead frame is taken out of the liquid and heated for 1-2hr. Then the film of the epoxy resin is formed on the outer surface of the lead pins 5. Thereafter, gold wires 3 are bonded by an ordinary method. The device is sealed with a sealing resin.

Inventors

• 👤 Shozo Nakamura
• 👤 省三 中村
• 👤 Aizo Kaneda
• 👤 金田　愛三
• 👤 Takeshi Matsui
• 👤 雄 松井
• 👤 Hajime Murakami
• 👤 元 村上

Bibliographic Details