Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
145 words
An integrated circuit package in which at least one semiconductor element (1) is mounted on an insulating substrate (4), and is accommodated in an airtight cell defined by the substrate (4), a cap (5) and sealing glass (6), ends of lead pieces (3) extending into the cell and being connected by wires (2) to element(s) (1), wherein the insulating substrate (4) is of a ceramics having a coefficient of thermal expansion from 35 to 40 x 10 /°C and a high thermal conductivity, the cap (5) is composed of a ceramics having a coefficient of thermal expansion of from 20 and 55 x 10 -7 /°C, the sealing glass has a coefficient of thermal expansion from 30 to 55 x 10 -7 /°C, and the lead pieces are composed of an alloy having a coefficient of thermal expansion smaller than 40 x 10 -7 /°C
Claim 2
Dependent Claim
145 words
An integrated circuit package in which at least one semiconductor element (1) is mounted on an insulating substrate (4), and is accommodated in an airtight cell defined by the substrate (4), a cap (5) and sealing glass (6), ends of lead pieces (3) extending into the cell and being connected by wires (2) to element(s) (1), wherein the insulating substrate (4) is of a ceramics having a coefficient of thermal expansion from 35 to 40 x 10 /°C and a high thermal conductivity, the cap (5) is composed of a ceramics having a coefficient of thermal expansion of from 20 and 55 x 10 -7 /°C, the sealing glass has a coefficient of thermal expansion from 30 to 55 x 10 -7 /°C, and the lead pieces are composed of an alloy having a coefficient of thermal expansion smaller than 40 x 10 -7 /°C
Claim 3
Dependent Claim
18 words
An integrated circuit package according to claim 1, wherein the lead pieces (3) are of a Ni-Co-Fe alloy.
Claim 4
Dependent Claim
36 words
An integrated circuit package according to claim 1, or claim 2, wherein the lead pieces (3) are of an iron alloy which contains nickel and cobalt and has a martensite transformation temperature of less than -55°C.
Claim 5
Dependent Claim
38 words
An integrated circuit package according to claim 3, wherein the iron alloy has a composition consisting of 2 9 to 31% by weight of nickel, 12.5 to 15.5% by weight of cobalt, and the remainder being substantially iron.
Claim 6
Dependent Claim
26 words
An integrated circuit package according to claim 4, wherein the iron alloy is annealed at a temperature ranging from 100° to 600°C to remove the stress.
Claim 7
Dependent Claim
35 words
An integrated circuit package according to any one of the preceding claims, wherein the sealing glass (6) is a low-melting glass that permits the sealing operation to be effected at a temperature less than 470°C.
Claim 8
Dependent Claim
23 words
An integrated circuit package according to any one of the preceding claims, wherein the substrate (4) is a sintered product of silicon carbide.
Claim 9
Dependent Claim
46 words
An integrated circuit package according to claim 7, wherein the sintered product has a composition which contains at least either one of beryllium or a beryllium compound in an amount of 0.05 to 5% by weight reckoned as beryllium, and the remainder being substantially silicon carbide.
Claim 10
Dependent Claim
24 words
An integrated circuit package according to any one of claims 1 to 6, wherein the substrate (4) is a sintered product of aluminium nitride.
Claim 11
Dependent Claim
31 words
An integrated circuit package according to any one of the preceding claims, wherein the cap (5) is any one of mullite ceramics, silicon carbide ceramics, zircon ceramics, or silicon nitride ceramics.
Claim 12
Dependent Claim
29 words
An integrated circuit package according to any one of the preceding claims, wherein the glass (6) is any one of S-eucryptite, lead titanate-type glass or lead borate- type glass.