Bipolar field-effect electrically erasable programmable read only memory cell and method of manufacture

Claim 2

In an MOS transistor comprising a silicon substrate, including source and drain regions formed of a semiconductor material having one conductivity type and a channel region formed of a semiconductor material having a conductivity type opposite the conductivity type of the semiconductor material forming the source and drain regions, the channel region being disposed between and contacting the source and drain regions, a method of making a floating gate electrically erasable MOS transistor comprising the steps of: forming a control gate region in the substrate generally coplanar with and spaced apart from the channel region, the source region, and the drain region; growing a layer of silicon dioxide over the channel and control gate regions; blanket depositing a first polysilicon layer over the substrate; and etching the polysilicon layer and the silicon dioxide layer from the substrate except for a continuous portion of the polysilicon layer extending from the control gate region to the channel region.

Claim 3

The method according to claim 1 wherein the etching step comprises the step of: etching the polysilicon layer and the silicon dioxide layer so that the continuous portion of the polysilicon layer only partially covers the control gate region.

Claim 4

The method according to claim 2 wherein the etching step further comprises the step of: etching the polysilicon layer and the silicon dioxide layer so that the continuous portion of the polysilicon layer completely covers the channel region.

Claim 5

The method according to claim 2 further comprising the step of: depositing a second polysilicon layer over the control gate region.

Claim 6

The method according to claim 4 further comprising the step of: etching the second polysilicon layer for forming a polysilicon contact separated from the bridge and contacting the control gate region.

Claim 7

The method according to claim 5 wherein the second polysilicon layer depositing step comprises the step of: blanket depositing a second polysilicon layer over the substrate.

Claim 8

In an MOS transistor comprising a silicon substrate including source and drain regions formed of a semiconductor material having a conductivity type opposite the conductivity type of the semiconductor material forming the source and drain regions, the channel region being disposed between and contacting the source and drain regions, a method of making a floating gate electrically erasable MOS transistor comprising the steps of: forming a control gate region in the substrate generally coplanar with and spaced apart from the channel region, the source region, and the drain region; growing a layer of silicon dioxide over the channel region and the gate region; blanket depositing a first polysilicon layer over the substrate; etching the first polysilicon layer and the silicon dioxide layer from the substrate except for a continuous portion of the first polysilicon layer extending from the control gate region to the channel region; blanket depositing a second polysilicon layer over the substrate; etching the second polysilicon layer from the substrate except for a continuous portion of the second polysilicon layer extending from the control gate region to the channel region over the first polysilicon layer; and wherein the continuous portion of the first polysilicon layer and the continuous portion of the second polysilicon layer define a floating gate.

Claim 9

In an MOS transistor comprising a silicon substrate including source and drain regions formed of a semiconductor material having a conductivity type opposite the conductivity type of the semiconductor material forming the source and drain regions, the channel region being disposed between and contacting the source and drain regions, a method of making a floating gate electrically erasable MOS transistor comprising the steps of: forming a control gate region in the substrate generally coplanar with and spaced apart from the channel region, the source region, and the drain region; growing a layer of silicon dioxide over the channel region and the gate region; blanket depositing a first polysilicon layer over the substrate; etching the first polysilicon layer and the silicon dioxide layer from the substrate except for a continuous portion of the first polysilicon layer extending from the control gate region to the channel region; blanket depositing a second polysilicon layer over the substrate; etching the second polysilicon layer from the substrate except for a continuous portion of the second polysilicon layer extending from the control gate region to the channel region over the first polysilicon layer; and wherein the continuous portion of the first polysilicon layer and the continuous portion of the second polysilicon layer define a floating gate.

Claim 10

The method according to claim 7 wherein the first polysilicon layer depositing step comprises the step of depositing the first polysilicon layer to a thickness of approximately 500 angstroms, and wherein the second polysilicon layer depositing step comprises the step of depositing the second polysilicon layer to a thickness of approximately 4500 angstroms.

Claim 11

The method according to claim 7 wherein the first polysilicon layer etching step comprises the step of etching the first polysilicon layer so that the continuous portion of the first polysilicon layer only partially covers the control gate region, and wherein the second polysilicon layer etching step comprises the step of etching the second polysilicon layer so that the continuous portion of the second polysilicon layer only partially cover the control gate region.

Claim 12

The method according to claim 9 wherein the first polysilicon layer etching step comprises the step of etching the first polysilicon layer so that the continuous portion of the first polysilicon layer completely covers the channel region, and wherein the second polysilicon layer etching step comprises the step of etching the second polysilicon layer so that the continuous portion of the second polysilicon layer completely covers the channel region.

Claim 13

The method according to claim 9 wherein the second polysilicon layer etching step further comprises the step of etching the second polysilicon layer for forming a polysilicon contact spaced apart from the floating gate and contacting the control gate region.

Claim 14

The method according to claim 11 further comprising the steps of: implanting the control gate region with an impurity having a conductivity type that is the same as the conductivity type of the source region and the drain region; implanting the portion of the second polysilicon layer defining the floating gate with an impurity having a conductivity type that is opposite the conductivity type of the source region and the drain region; and implanting the portion of the second polysilicon layer contacting the control gate region with an impurity having a conductivity type that is the same as the conductivity type of the source region and the drain region.

Claim 15

In an MOS transistor comprising a silicon substrate including source and drain regions formed of a semiconductor material having a conductivity type opposite the conductivity type of the semiconductor material forming the source and drain regions, the channel region being disposed between and contacting the source and drain regions, a method of making a floating gate electrically erasable MOS transistor comprising the steps of, in sequence: forming a control gate region in the substrate generally coplanar with and spaced apart from the channel region, the source region, and the drain region; growing a first layer of silicon dioxide over the channel region and the gate region; blanket depositing a first polysilicon layer over the substrate; etching the first polysilicon layer and the first silicon dioxide layer from the substrate except for a continuous portion of the first polysilicon layer extending from the control gate region to the channel region; blanket depositing a second polysilicon layer over the substrate; forming a second silicon dioxide layer over the second polysilicon layer; masking the second silicon dioxide layer except over portions of the second silicon dioxide layer covering the continuous portion of the first polysilicon layer; implanting the second polysilicon layer a first time through the unmasked portions of the second silicon dioxide layer with an impurity having a conductivity type that is opposite the conductivity type of the source region and the drain region; etching the second polysilicon layer and the second silicon dioxide layer from the substrate except for a continuous first portion of the second polysilicon layer extending from the control gate region to the channel region over the first polysilicon layer and except for a second portion of the second polysilicon layer contacting the control gate region and spaced apart from the continuous portion of the first polysilicon layer and from the continuous portion of the second polysilicon layer; and wherein the continuous portion of the first polysilicon layer and the continuous portion of the second polysilicon layer define a floating gate.

Claim 16

In an MOS transistor comprising a silicon substrate including source and drain regions formed of a semiconductor material having a conductivity type opposite the conductivity type of the semiconductor material forming the source and drain regions, the channel region being disposed between and contacting the source and drain regions, a method of making a floating gate electrically erasable MOS transistor comprising the steps of, in sequence: forming a control gate region in the substrate generally coplanar with and spaced apart from the channel region, the source region, and the drain region; growing a first layer of silicon dioxide over the channel region and the gate region; blanket depositing a first polysilicon layer over the substrate; etching the first polysilicon layer and the first silicon dioxide layer from the substrate except for a continuous portion of the first polysilicon layer extending from the control gate region to the channel region; blanket depositing a second polysilicon layer over the substrate; forming a second silicon dioxide layer over the second polysilicon layer; masking the second silicon dioxide layer except over portions of the second silicon dioxide layer covering the continuous portion of the first polysilicon layer; implanting the second polysilicon layer a first time through the unmasked portions of the second silicon dioxide layer with an impurity having a conductivity type that is opposite the conductivity type of the source region and the drain region; etching the second polysilicon layer and the second silicon dioxide layer from the substrate except for a continuous first portion of the second polysilicon layer extending from the control gate region to the channel region over the first polysilicon layer and except for a second portion of the second polysilicon layer contacting the control gate region and spaced apart from the continuous portion of the first polysilicon layer and from the continuous portion of the second polysilicon layer; and wherein the continuous portion of the first polysilicon layer and the continuous portion of the second polysilicon layer define a floating gate.

Claim 17

The method according to claim 13 wherein the first polysilicon layer depositing step comprises the step of depositing the first polysilicon layer to a thickness of approximately 500 angstroms, and wherein the second polysilicon layer depositing step comprises the step of depositing the second polysilicon layer to a thickness of approximately 4500 angstroms.

Claim 18

The method according to claim 13 further comprising the steps of, after the first polysilicon layer implanting step and prior to the second polysilicon layer etching step, in sequence: unmasking the second silicon dioxide layer; masking the second silicon dioxide layer for covering the floating gate and for exposing portions of the second silicon dioxide layer disposed over a portion of the second polysilicon layer which contacts the control gate region; and implanting the second polysilicon layer a second time through the unmasked portions of the second silicon dioxide layer with an impurity having a conductivity type that is the same as the conductivity type of the source region and the drain region.

Claim 19

The method according to claim 15 further comprising the steps of, after the second polysilicon layer implanting step and prior to the second polysilicon layer etching step, in sequence: unmasking the first silicon dioxide layer; forming a third silicon dioxide layer over the second silicon dioxide layer; and annealing the first and second implants.

Claim 20

The method according to claim 16 further comprising the step of, after the annealing step and prior to the second polysilicon layer etching step: removing the second silicon dioxide layer and the third silicon dioxide layer except the portions of the second and third silicon dioxide layer covering the floating gate.

Claim 21

The method according to claim 17 further comprising the step of, after the second silicon dioxide layer and third silicon dioxide layer removing step and prior to the second polysilicon layer etching step, in sequence: forming a fourth silicon dioxide layer over the portion of the second polysilicon layer contacting the control gate region; and blanket coating the substrate with a silicon nitride layer.

Claim 22

The method according to claim 18 wherein the first polysilicon layer depositing step comprises the step of depositing the first polysilicon layer to a thickness of approximately 500 angstroms, and wherein the second polysilicon layer depositing step comprises the step of depositing the second polysilicon layer to a thickness of approximately 4500 angstroms.