Abstract A method of making a pattern of tungsten interconnection comprising the step of: forming a polysilicon film (18) over a first insulating film (12) on a semiconductor substrate (11) and doping impurities; forming a high doped oxide film (19) over the polysilicon film and subsequently forming a metal interconnect pattern; growing selectively tungsten (15) on an exposed portion of the polysilicon film; stripping the high doped oxide film by wet etching and etching a residual (20) of the tungsten formed on the oxide film; and dry etching the polysilicon by using the tungsten on the polysilicon as a etching mask leaving only the polysilicon underneath the tungsten. The method can solve the troubles produced when the tungsten is used as metal interconnect material and improve the operation speed of the semiconductor devices with the interconnection of the tungsten metal, offering a reliability of the device for a long time operation.
A method of making a pattern of tungsten interconnection, comprising the steps of: (a) forming a doped polysilicon film over a first insulating film on a semiconductor substrate; (b) forming a highly doped oxide film over the polysilicon film and providing a pattern of openings through the oxide film exposing surface portions of the polysilicon film; (c) growing selectively tungsten on the exposed portions of the polysilicon film; (d) removing the highly doped oxide film by wet etching and removing any residual of the tungsten formed on the oxide film at the same time; and (e) dry etching the polysilicon using the tungsten on the polysilicon as an etching mask leaving only the polysilicon underneath the tungsten.
Claim 2
Independent Claim
117 words
A method of making a pattern of tungsten interconnection, comprising the steps of: (a) forming a doped polysilicon film over a first insulating film on a semiconductor substrate; (b) forming a highly doped oxide film over the polysilicon film and providing a pattern of openings through the oxide film exposing surface portions of the polysilicon film; (c) growing selectively tungsten on the exposed portions of the polysilicon film; (d) removing the highly doped oxide film by wet etching and removing any residual of the tungsten formed on the oxide film at the same time; and (e) dry etching the polysilicon using the tungsten on the polysilicon as an etching mask leaving only the polysilicon underneath the tungsten.
Claim 3
Dependent Claim
23 words
A method according to claim 1, wherein in step (b) the highly doped oxide film is one of PSG, ASG and SOG films.
Claim 4
Dependent Claim
22 words
A method according to claim 1, wherein photomasking and etching processes are used to provide the pattern of openings in step (b).
Claim 5
Dependent Claim
31 words
A method according to claim 1, wherein H 2 , WF 6 and SiH 4 are caused to react with each other at 300° C. in the performance of step (c).
Claim 6
Dependent Claim
26 words
A method according to claim 2 wherein said highly doped oxide film is phosphorous silicate glass having a phosphorous content in the range of 8-15 percent.