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US5075199A Expired / Lapsed US ⏱️ 0.0 years remaining

Radiation sensitive mixture and production of relief patterns

Assignee: BASF SE
•
Filing: 1989-05-16
•
Granted: 1991-12-24
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Expires: 2009-05-16
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Abstract

Abstract A radiation sensitive mixture useful for producing relief patterns contains (a) a polymeric binder which is insoluble in water but soluble in aqueous alkaline solutions and (b) an organic compound whose solubility in an aqueous alkaline developer is increased by the action of acid and which contains at least one acid cleavable group and also a group which on irradiation forms a strong acid, wherein the polymeric binder (a) contains from 5 to 40 mol % of monomer units having ##STR1## in copolymerized or cocondensed form or the ##STR2## introduced by polymer analogous reaction with the proviso that the radical R contains from 5 to 9 carbon atoms.

Inventors

  • 👤 Reinhold Schwalm
  • 👤 Horst Binder

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 18:48
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/0045

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 103 words
A radiation sensitive mixture containing (a) a polymeric binder which is insoluble in water but soluble in aqueous alkaline solutions and (b) an organic compound whose solubility in an aqueous alkaline developer is increased by the action of acid and which contains at least one acid cleavable group and also a group which on irradiation forms a strong acid, wherein the polymeric binder (a) contains from 5 to 40 mol % of monomer units having ##STR15## in copolymerized or cocondensed form or the ##STR16## introduced by polymer analogous reaction, with the proviso that the radical R contains from 5 to 9 carbon atoms.
Claim 2
Dependent Claim 103 words
A radiation sensitive mixture containing (a) a polymeric binder which is insoluble in water but soluble in aqueous alkaline solutions and (b) an organic compound whose solubility in an aqueous alkaline developer is increased by the action of acid and which contains at least one acid cleavable group and also a group which on irradiation forms a strong acid, wherein the polymeric binder (a) contains from 5 to 40 mol % of monomer units having ##STR15## in copolymerized or cocondensed form or the ##STR16## introduced by polymer analogous reaction, with the proviso that the radical R contains from 5 to 9 carbon atoms.
Claim 3
Dependent Claim 54 words
A radiation sensitive mixture as recited in claim 1, wherein the polymeric binder (a) used in poly(p-hydroxystyrene), poly(p-hydroxy-α-methylstyrene) or a copolymer of p-hydroxystyrene and p-hydroxy-α-methylstyrene, with the proviso that from 5 to 40 mol % of the p-hydroxy(α-methyl)styrene units carry a C 5 -C 9 -alk(en)yloxycarbonyloxy radical in place of the phenolic hydroxyl group.
Claim 4
Dependent Claim 62 words
A radiation sensitive mixture as recited in claim 1, wherein the polymeric binder (a) used is a novolak based on p-cresol and formaldehyde in which from 5 to 40 mol % of the cocondensed p-cresol units have been replaced by groups of the formula ##STR17## where R is alkyl, alkenyl, alkynyl, cycloalkyl or cycloalkenyl each of from 5 to 9 carbon atoms.
Claim 5
Dependent Claim 114 words
A radiation sensitive mixture as recited in claim 1, wherein the organic compound (b) is sulfonium salt of the general formula (I) ##STR18## where R 1 , R 2 and R 3 are identical to or different from one another and each is singly acyclyl or aryl which may each contain heteroatoms, or two of R 1 to R 3 together form a ring, with the proviso that at least one of R 1 to R 3 contains at least one acid cleavable group, one of R 1 to R 3 can be bonded to one or more further sulfonium salt residues directly or via acid cleavable groups, and X.sup.⊖ is a nonnucleophilic counterion.
Claim 6
Dependent Claim 114 words
A radiation sensitive mixture as recited in claim 2, wherein the organic compound (b) is sulfonium salt of the general formula (I) ##STR19## where R 1 , R 2 and R 3 are identical to or different from one another and each is singly acyclyl or aryl which may each contain heteroatoms, or two of R 1 to R 3 together form a ring, with the proviso that at least one of R 1 to R 3 contains at least one acid cleavable group, one of R 1 to R 3 can be bonded to one or more further sulfonium salt residues directly or via acid cleavable groups, and X.sup.⊖ is a nonnucleophilic counterion.
Claim 7
Dependent Claim 114 words
A radiation sensitive mixture as recited in claim 3, wherein the organic compound (b) is sulfonium salt of the general formula (I) ##STR20## where R 1 , R 2 and R 3 are identical to or different from one another and each is singly acyclyl or aryl which may each contain heteroatoms, or two of R 1 to R 3 together form a ring, with the proviso that at least one of R 1 to R 3 contains at least one acid cleavable group, one of R 1 to R 3 can be bonded to one or more further sulfonium salt residues directly or via acid cleavable groups, and X.sup.⊖ is a nonnucleophilic counterion.
Claim 8
Dependent Claim 61 words
A process for producing relief pattern and relief images, which comprises spin-coating a solution of a radiation sensitive mixture as recited in claim 1 onto a wafer to form a resist film, drying the coated wafer by heating, exposing the coated dried wafer imagewise with X-rays, electron beams or UV radiation, heating the exposed film and developing with an aqueous-alkaline solvent.
Claim 9
Dependent Claim 28 words
A process for producing relief patterns as recited in claim 7, wherein irradiation of the radiation sensitive mixture is followed by heating at from 60° to 120° C.
Claim 10
Dependent Claim 62 words
A process for producing relief pattern and relief images, which comprises spin-coating a solution of a radiation sensitive mixture as recited in claim 2 onto a wafer to form a resist film, drying the coated wafer by heating, exposing the coated and dried wafer imagewise with X-rays, electron beams or UV radiation, heating the exposed film and developing with an aqueous-alkaline solvent.
Claim 11
Dependent Claim 62 words
A process for producing relief pattern and relief images, which comprises spin-coating a solution of a radiation sensitive mixture as recited in claim 3 onto a wafer to form a resist film, drying the coated wafer by heating, exposing the coated and dried wafer imagewise with X-rays, electron beams or UV radiation, heating the exposed film and developing with an aqueous-alkaline solvent.

References Cited (Backward Citations)

US3915706A Cited
US4491628A Cited
US4678737A Cited
US4689288A Cited
US4770977A Cited
US4663269A Cited
JPS6238450A Cited
DE3628046A1 Cited
US4820607A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-12-23 1995-06-24 1995-12-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-12-23 1999-06-24 1999-12-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-12-23 2003-06-24 2003-12-24 $7700.00 Window Closed / Lapsed

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