US5055164A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrodepositable photoresists for manufacture of hybrid circuit boards
Assignee: Shipley Co Inc
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Filing: 1990-03-26
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Granted: 1991-10-08
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Expires: 2010-03-26
Abstract
Abstract The disclosed invention relates to a method of manufacturing hybrid circuit boards which uses the step of electrodeposition of a photoresist composition onto said boards. This step represents improvements in the prior art use of dry film or other types of photoresists which did not conform to all three dimensional surfaces and which were not aqueous developable.
Inventors
- 👤 Robert E. Hawkins
- 👤 Richard Small
- 👤 Alaric Naiman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:52
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H10W70/00; H10W70/01; H10W70/05; H05K1/02; H05K1/0284; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/00; H05K3/10; H05K3/108; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
99 words
A method for forming a hybrid circuit board comprising: a. providing a three-dimensional featured ceramic substrate having sequentially applied thereon, a resistive layer, a diffusion barrier layer and a metallic conductive layer thereby forming a conductive coating; b. electrodepositing a photoresist on said conductive coating; c. imaging said photoresist whereby portions of said conductive coating are exposed; d. plating said exposed portions of the conductive coating with a conductive metal; e. stripping said imaged photoresist whereby a stripped surface of said metallic conductive layer is exposed; and f. etching said stripped surface thereby exposing said three-dimensional featured ceramic substrate.
Claim 2
Independent Claim
99 words
A method for forming a hybrid circuit board comprising: a. providing a three-dimensional featured ceramic substrate having sequentially applied thereon, a resistive layer, a diffusion barrier layer and a metallic conductive layer thereby forming a conductive coating; b. electrodepositing a photoresist on said conductive coating; c. imaging said photoresist whereby portions of said conductive coating are exposed; d. plating said exposed portions of the conductive coating with a conductive metal; e. stripping said imaged photoresist whereby a stripped surface of said metallic conductive layer is exposed; and f. etching said stripped surface thereby exposing said three-dimensional featured ceramic substrate.
Claim 3
Dependent Claim
32 words
The method of claim 1 wherein said ceramic substrate is selected from the group consisting of alumina, beryllia, aluminun nitride, silicon nitride, boron nitride, silicon, silicon carbide, enameled metal or mixtures thereof.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein said ceramic substrate is an alunina based ceramic.
Claim 5
Dependent Claim
25 words
The method of claim 1 whrein said resistive layer is selected from the group consisting of nickel chrome alloy, tantalum nitride, chromium-silicon oxide or titanium.
Claim 6
Dependent Claim
11 words
The method of claim 1 wherein said resistive layer is titanium.
Claim 7
Dependent Claim
20 words
The method of claim 1 wherein said diffusion barrier layer is selected from the group consisting of nickel or palladium.
Claim 8
Dependent Claim
12 words
The method of claim 1 wherein said diffusion barrier layer is nickel.
Claim 9
Dependent Claim
22 words
The method of claim 1 wherein said metallic conductive layer is selected from the group consisting of gold, copper, nickel, or silver.
Claim 10
Dependent Claim
12 words
The method of claim 1 wherein said metallic conductive layer is copper.
Claim 11
Dependent Claim
18 words
The method of claim 1 wherein said imaging step further comprises the steps of imagewise exposing and developing.
Claim 12
Dependent Claim
13 words
The method of claim 10 wherein said developing step utilizes an aqueous developer.
Claim 13
Dependent Claim
11 words
The method of claim 1 wherein said plating is done electrolessly.
Claim 14
Dependent Claim
11 words
The method of claim 1 wherein said plating is done electrolytically.
Claim 15
Dependent Claim
11 words
The method of claim 1 wherein said conductive metal is copper.
Claim 16
Dependent Claim
11 words
The method of claim 1 wherein said conductive metal is gold.
Claim 17
Dependent Claim
13 words
The method of claim 1 wherein said stripping step utilizes an aqueous stripper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |