US4373019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thick film fine pattern forming method
Assignee: Fujitsu Ltd
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Filing: 1979-08-28
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Granted: 1983-02-08
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Expires: 1999-08-28
Abstract
Abstract PCT No. PCT/JP79/00228 Sec. 371 Date Apr. 31, 1980 Sec. 102(e) Date Apr. 9, 1980 PCT Filed Aug. 28, 1979 PCT Pub. No. WO80/00520 PCT Pub. Date Mar. 20, 1980.A method of forming a thick film pattern wherein a circuit forming paste (such as conductor paste, resistor paste, etc.), is coated onto an insulated substrate and photo-resist is coated on the surface of the paste film after the paste has been dried. Either the paste or the photo-resist should be oily while the other is aqueous so that the resist and paste may later be selectively dissolved in different liquids. A fine, thick film pattern can then be formed by photo-etching technology.
Inventors
- 👤 Yutaka Watanabe
- 👤 Hisayasu Matsuo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:38
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; H05K3/061; H05K3/064
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
77 words
A method of forming a thick film fine pattern on a substrate, comprising the steps of: coating the surface of the substrate with a thermoplastic resin bonding layer; coating said bonding layer with a thick film circuit forming paste including an organic solvent; drying the paste; coating the dried paste with water soluble photoresist; exposing a pattern onto the photo-resist; developing the photo-resist to expose portions of the paste; eliminating the exposed paste; and baking the substrate.
Claim 2
Independent Claim
77 words
A method of forming a thick film fine pattern on a substrate, comprising the steps of: coating the surface of the substrate with a thermoplastic resin bonding layer; coating said bonding layer with a thick film circuit forming paste including an organic solvent; drying the paste; coating the dried paste with water soluble photoresist; exposing a pattern onto the photo-resist; developing the photo-resist to expose portions of the paste; eliminating the exposed paste; and baking the substrate.
Claim 3
Dependent Claim
57 words
A method of forming a thick film fine pattern as claimed in the claim 1, wherein the step of coating the surface of the substrate with a thermoplastic resin bonding layer is conducted by coating the surface of the substrate with a thermoplastic resin having a softening point below the drying temperature of the thick film paste.
Claim 4
Dependent Claim
36 words
A method of forming a thick film fine pattern as claimed in the claim 1 or 2, further comprising the step of smoothing the surface of the thick film paste before coating the paste with photo-resist.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-02-07 | 1986-08-09 | 1987-02-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-02-07 | 1990-08-09 | 1991-02-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-02-07 | 1994-08-09 | 1995-02-08 | $7700.00 | Window Closed / Lapsed |