US4119480A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing thick-film circuit devices
Assignee: Toshiba Corp
•
Filing: 1977-05-10
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Granted: 1978-10-10
•
Expires: 1997-05-10
Abstract
Abstract A method of manufacturing thick-film circuit devices which comprises depositing a photosensitive resin on a substrate either before or after the deposition of a paste for thick-film circuit, exposing the photosensitive resin selectively to light and thereby forming a predetermined thick-film paste pattern, and then firing the paste pattern.
Inventors
- 👤 Yusaku Nishi
- 👤 Hideo Fujii
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 01:23
CPC Classifications
G; G03; G03F; G03F7/00; H; H05; H05K; H05K3/00; H05K3/02; H10; H10D; H10D84/00; H10D84/01
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
96 words
A method of manufacturing a thick-film circuit device comprising: depositing a paste material for thick-film circuit use all over the effective surface area of a substrate and drying the paste material to evaporate a thinner contained in the paste material to make the paste material porous; depositing a photosensitive resin on the paste material and drying the resin to partially diffuse the resin into the porous material; exposing the photosensitive resin selectively to light; removing the unnecessary parts of the photosensitive resin and of the paste material; and firing the paste material attached to the substrate.
Claim 2
Independent Claim
96 words
A method of manufacturing a thick-film circuit device comprising: depositing a paste material for thick-film circuit use all over the effective surface area of a substrate and drying the paste material to evaporate a thinner contained in the paste material to make the paste material porous; depositing a photosensitive resin on the paste material and drying the resin to partially diffuse the resin into the porous material; exposing the photosensitive resin selectively to light; removing the unnecessary parts of the photosensitive resin and of the paste material; and firing the paste material attached to the substrate.
Claim 3
Dependent Claim
33 words
A method as claimed in claim 1 wherein the removing step of the unnecessary parts of the photosensitive resin and of the paste material is effected simultaneously by treatment with an etching solution.
Claim 4
Dependent Claim
41 words
A method as claimed in claim 1 wherein, prior to the application of a photosensitive resin, the paste material is allowed to absorb a sufficient quantity of water for preventing air bubbles from subsequently being generated out of the paste material.
Claim 5
Dependent Claim
44 words
A method as claimed in claim 1 wherein the deposition of a photosensitive resin on said paste material is carried out by thermally laminating a dry film to said paste material, said dry film consisting of a film having said photosensitive resin deposited thereon.
Claim 6
Dependent Claim
16 words
A method as claimed in claim 1 wherein said paste material is an electrically insulating one.
Claim 7
Dependent Claim
15 words
A method as claimed in claim 1 wherein said photosensitive resin is soluble in water.
Claim 8
Independent Claim
84 words
A method of manufacturing thick-film circuit devices which comprises using a photosensitive resin to form a predetermined thick-film paste pattern and then firing said paste pattern which comprises depositing a photosensitive resin on a substrate; exposing said photosensitive resin selectively to light; removing the unnecessary parts of said photosensitive resin thereby forming openings; filling a paste material for thick-film circuit use into the openings from which said photosensitive resin was removed; and then removing the remaining photosensitive resin and firing the filled paste material.
Claim 9
Independent Claim
84 words
A method of manufacturing thick-film circuit devices which comprises using a photosensitive resin to form a predetermined thick-film paste pattern and then firing said paste pattern which comprises depositing a photosensitive resin on a substrate; exposing said photosensitive resin selectively to light; removing the unnecessary parts of said photosensitive resin thereby forming openings; filling a paste material for thick-film circuit use into the openings from which said photosensitive resin was removed; and then removing the remaining photosensitive resin and firing the filled paste material.
Claim 10
Dependent Claim
16 words
A method as claimed in claim 7 wherein said paste material is an electrically conductive one.
Claim 11
Dependent Claim
32 words
A method as claimed in claim 7 wherein the filling of a paste material for thick-film circuit use is carry out by forcing said paste material into said openings with a squeegee.
Claim 12
Dependent Claim
34 words
A method as claimed in claim 7 wherein the filling of a paste material for thick-film circuit use is carried out by filling and drying said paste material and then repeating the same procedure.
Claim 13
Dependent Claim
15 words
A method as claimed in claim 7 wherein said photosensitive resin is soluble in water.
Claim 14
Dependent Claim
42 words
A method as claimed in claim 7 wherein the deposition of a photosensitive resin on a substrate is carried out by thermally laminating a dry film to said substrate, said dry film consisting of a film having said photosensitive resin deposited thereon.
Claim 15
Dependent Claim
16 words
A method as claimed in claim 7 wherein said paste material is an electrically insulating one.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-10-09 | 1982-04-10 | 1982-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-10-09 | 1986-04-10 | 1986-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-10-09 | 1990-04-10 | 1990-10-10 | $7700.00 | Window Closed / Lapsed |