US3666549A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making additive printed circuit boards and product thereof
Assignee: MacDermid Inc
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Filing: 1969-05-09
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Granted: 1972-05-30
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Expires: 1989-05-09
Abstract
Abstract A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS USING THE ADDITIVE PROCESS. IMPROVEMENT OVER THE PRIOR ART IS OBTAINED IN RESPECT TO ADHESION OF THE CONDUCTOR METAL CIRCUIT TO A THERMOSET RESIN SUBSTRATE. IN THE PROCESS, A NICKEL OF COPPER CLAD THERMOSET RESIN SUBSTRATE IS STRIPPED OF ALL METAL ACTIVATED (CATALYZED), A RESIST PATTERN APPLIED TO OBTAIN THE DESIRED CIRCUIT AND A CONDUCTOR METAL DEPOSITED ON THE CIRCUIT AREA BY ELECTROLESS AND/OR ELECTRODEPOSITION TO A FINAL DESIRED THICKNESS. AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED. VARIOUS TYPES OF CIRCUIT BOARDS RESULTING FROM THE PROCESS ARE ALSO DISCLOSED.
Inventors
- 👤 Harold L Rhodenizer
- 👤 John J Grunwald
- 👤 William P Innes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:33
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; H05K3/108; H05K3/38; H05K3/381; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K2203/11; H05K2203/1105; H05K2203/1152; H05K2203/14; H05K2203/1407; H05K3/02; H05K3/06; H05K3/061; H05K3/062
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-30 | 1975-11-29 | 1976-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-30 | 1979-11-29 | 1980-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-30 | 1983-11-29 | 1984-05-30 | $7700.00 | Window Closed / Lapsed |