US5047834A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High strength low stress encapsulation of interconnected semiconductor devices
Assignee: International Business Machines Corp
•
Filing: 1990-08-27
•
Granted: 1991-09-10
•
Expires: 2010-08-27
Abstract
Abstract A semiconductor packaging technique employing a high Young's modulus, localized, external connection to pad, bond immobilizing member, together with, as needed, a low Young's modulus environmental protection covering member. A chip of Si or GaAs has an annulus of high Young's modulus epoxy over the line of external connections such as beam leads or wire bonds near the edge and a coating of silicone over the entire chip surface including the annulus.
Inventors
- 👤 Caroline A. Kovac
- 👤 Ismail C. Noyan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W70/00; H10W70/40; H10W70/479; H10W72/60; H10W74/00; H10W74/10; H10W74/131; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/251; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
114 words
An electronic assembly comprising: a semiconductor device having a surface area with electrical contact locations, said semiconductor device being of a material taken from the group of Si and GaAs, at least one external electrical connecting member having an inner and outer end, each said inner end being bonded to a contact location on said semiconductor device, a quantity of epoxy immobilization material positioned exclusively in the immediate vicinity of each connecting member bond at each contact location, the remaining portion of said surface area of said device being free of epoxy and, a layer of silicone encapsulating material covering the entirety of said epoxy free surface area and extending over said epoxy material.
Claim 2
Dependent Claim
114 words
An electronic assembly comprising: a semiconductor device having a surface area with electrical contact locations, said semiconductor device being of a material taken from the group of Si and GaAs, at least one external electrical connecting member having an inner and outer end, each said inner end being bonded to a contact location on said semiconductor device, a quantity of epoxy immobilization material positioned exclusively in the immediate vicinity of each connecting member bond at each contact location, the remaining portion of said surface area of said device being free of epoxy and, a layer of silicone encapsulating material covering the entirety of said epoxy free surface area and extending over said epoxy material.
Claim 3
Dependent Claim
116 words
A semiconductor device comprising in combination: a semiconductor chip of material taken from the group of Si and GaAs having in a broad surface thereof at least one electrical interconnection pad, at least one connecting member taken from the group of beam leads and wires each said connecting member having one end thereof bonded to a pad on said chip, an immobilizing member of epoxy material surrounding and encapsulating said bond only in the locality of said pad in a limited contact area, the remainder of said chip surface, being free of epoxy and, a layer of silicone environmental protecting encapsulant covering the entirety of said epoxy free chip surface and extending over said immobilizing member.
Claim 4
Dependent Claim
116 words
A semiconductor device comprising in combination: a semiconductor chip of material taken from the group of Si and GaAs having in a broad surface thereof at least one electrical interconnection pad, at least one connecting member taken from the group of beam leads and wires each said connecting member having one end thereof bonded to a pad on said chip, an immobilizing member of epoxy material surrounding and encapsulating said bond only in the locality of said pad in a limited contact area, the remainder of said chip surface, being free of epoxy and, a layer of silicone environmental protecting encapsulant covering the entirety of said epoxy free chip surface and extending over said immobilizing member.
Claim 5
Dependent Claim
93 words
In a semiconductor integrated circuit assembly of the type having connection members extending from a support to pads on the surface of a semiconductor chip to which pads said connection members are bonded, the improvement comprising: a quantity of epoxy immobilizing material surrounding and encapsulating each said pad to connection member bond only in a locality of said pad, the remaining area of said surface of said chip being free of said immobilizing material, and, silicone environmental protecting means encapsulating at least the entirety of said immobilizing material free surface of said chip.
Claim 6
Dependent Claim
93 words
In a semiconductor integrated circuit assembly of the type having connection members extending from a support to pads on the surface of a semiconductor chip to which pads said connection members are bonded, the improvement comprising: a quantity of epoxy immobilizing material surrounding and encapsulating each said pad to connection member bond only in a locality of said pad, the remaining area of said surface of said chip being free of said immobilizing material, and, silicone environmental protecting means encapsulating at least the entirety of said immobilizing material free surface of said chip.
Claim 7
Dependent Claim
53 words
The semiconductor integrated circuit assembly of claim 3 wherein said pads on said chip are in a line near at least one edge of said chip and said quantity of immobilizing material contacts said chip only in the line of said pads the remainder of said chip being free of said immobilizing material.
Claim 8
Dependent Claim
110 words
Semiconductor electronic apparatus comprising in combination: a semiconductor element having a surface area with electrical contact locations, at least one external electrical connecting member having an inner and an outer end, each said inner end being bonded to a contact location on said semiconductor element, a quantity of an epoxy immobilizing material positioned exclusively in the immediate vicinity of each connecting member bond at each contact location, the remaining portion of said surface area being free of said immobilizing material, and, a layer of silicone encapsulating material covering the entirety of the portion of said surface area that is free of said immobilizing material and extending over said immobilizing material.
Claim 9
Dependent Claim
110 words
Semiconductor electronic apparatus comprising in combination: a semiconductor element having a surface area with electrical contact locations, at least one external electrical connecting member having an inner and an outer end, each said inner end being bonded to a contact location on said semiconductor element, a quantity of an epoxy immobilizing material positioned exclusively in the immediate vicinity of each connecting member bond at each contact location, the remaining portion of said surface area being free of said immobilizing material, and, a layer of silicone encapsulating material covering the entirety of the portion of said surface area that is free of said immobilizing material and extending over said immobilizing material.
References Cited (Backward Citations)
US3742599A
Cited
US4026008A
Cited
US3764862A
Cited
US3839660A
Cited
US3909838A
Cited
US4001863A
Cited
US4250347A
Cited
DE2851951A1
Cited
US4296424A
Cited
JPS54133073A
Cited
JPS57133653A
Cited
JPS5821850A
Cited
US4658332A
Cited
JPS6094746A
Cited
US4604644A
Cited
JPS6224650A
Cited
US4788583A
Cited
US4839713A
Cited
JPS63240053A
Cited
JPS6461660A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-09 | 1995-03-11 | 1995-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-09 | 1999-03-11 | 1999-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-09 | 2003-03-11 | 2003-09-10 | $7700.00 | Window Closed / Lapsed |