Ic mounting method

Abstract

Abstract PURPOSE:To enhance the reliability of the IC and facilitate automatic assembly by simplifying the handling by a method wherein the IC is mounted on a multilayer wiring substrate not by molding but by cutting conductor leads of the IC by the use of a heat-dissipating case. CONSTITUTION:The IC4 is connected by fixing to the heat-dissipating case 1 at a heat-dissipating plane 5 with a thermal conductive adhesive 8 or the like. The outer connection conductor leads 7 are led out through recesses between the adjacent projections 3 of the case. Since the depth of the case is made larger than the height of the IC, the leads are designed to be not in contact with the IC part other than the terminals when they are led out. Besides, the IC protects and seals the circuit plane 6 in the case, and is therefore coated with a filler 9 such as epoxy or Si resin.

Inventors

• 👤 Koichi Yamanaka
• 👤 山中　孝一

Bibliographic Details