Abstract A foot portion is bent up from a planar, electrically conductive heat sink, and a header rigidly mounting circular cross-section electrical leads positions one of the leads in engagement with the foot portion. A semiconductor crystal is attached to the heat sink with a soft solder and a contact having an upstanding flange is similarly attached to the semiconductor crystal with a soft solder. The flange is attached to an electrical lead positioned by the header. A pliant, substantially fluid impervious material, such as silicone rubber, is cured around the semiconductor crystal and a casement is then molded to the leads and heat sink to form a shock and strain resistant semiconductive device. The header is in one form enclosed by the casement, but in alternate forms may be partially or entirely stripped after molding.
A process of simultaneously fabricating a plurality of separate multiple lead semiconductor devices comprising rigidly mounting in parallel relation spaced groups of lead means, each group of parallel lead means being intended for association in a separate semiconductor device, mating an extending portion of at least one lead means within each group with a conforming surface of an upstanding portion of an electrically conductive heat sink means, simultaneously providing a low impedance electrical interconnection of the mated lead means and heat sink means and attaching semiconductor crystal means to the heat sink means for each device in electrically conductive relation therewith, attaching connection means between a surface of each semiconductor crystal means remote from the heat sink means and one of the lead means within each group isolated from the heat sink means, placing a pliant, substantially fluid impervious material about each semiconductor crystal means, molding a casement about each semiconductor crystal means, associated heat sink means, and lead means group, and removing the physical interconnection between separate semiconductor devices.