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US4990983A Expired / Lapsed US ⏱️ 0.0 years remaining

Radiation hardened field oxides for NMOS and CMOS-bulk and process for forming

Assignee: Conexant Systems LLC
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Filing: 1987-12-07
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Granted: 1991-02-05
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Expires: 2007-12-07
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Abstract

Abstract The field oxide surrounding an NMOS device or the field oxide around the NMOS device and between the NMOS and PMOS devices in CMOS is split or notched to make at least one thin field oxide region under which a degenerative P+ region is formed in the substrate to increase threshold voltages of the undesired field oxide FET.

Inventors

  • 👤 Frank Z. Custode
  • 👤 John G. Poksheva

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 19:30
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D84/859; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/012; H10W10/0125; H10W10/0126; H10W10/10; H10W10/13; Y; Y10; Y10S; Y10S257/00; Y10S257/906

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 106 words
An NMOS device having hardened field isolation comprising, in combination: a P doped substrate, an N doped source and drain in the substrate; a P doped channel between the source and drain; a gate over the channel; a field oxide region in and above the substrate and surrounding the device; said field oxide region having thick portions and a thin portion relative to the rest of the region which thin portion surrounds the ice and at least is partly embedded in the substrate, and a highly P degenerated doped region in the substrate directly beneath and against the thin field oxide portion also surrounding the device.
Claim 2
Dependent Claim 106 words
An NMOS device having hardened field isolation comprising, in combination: a P doped substrate, an N doped source and drain in the substrate; a P doped channel between the source and drain; a gate over the channel; a field oxide region in and above the substrate and surrounding the device; said field oxide region having thick portions and a thin portion relative to the rest of the region which thin portion surrounds the ice and at least is partly embedded in the substrate, and a highly P degenerated doped region in the substrate directly beneath and against the thin field oxide portion also surrounding the device.
Claim 3
Dependent Claim 36 words
The device of claim 1, wherein: the P-doping concentration in the highly P doped region preferably exceeds 10 18 atoms per cubic centimeter to increase the threshold voltage of the thin oxide in the thin portion.
Claim 4
Dependent Claim 23 words
The device of claim 1 wherein: the thin portion of the field oxide is of the order of 1 to 2 microns wide.
Claim 5
Dependent Claim 53 words
The device of claim 1, wherein: the thickness of the thin portion is of the order of 1/2 or less the thickness of the field oxide not in the thin portion, said thin field oxide having a thickness of approximately 2000 Å because the thinner the thin portion, the higher the radiation tolerance.
Claim 6
Dependent Claim 34 words
The device of claim 1, further comprising a layer of polysilicon over the field oxide adjacent both the thick and thin region; and, connections respectively to the source and drain through the polysilicon layer.
Claim 7
Dependent Claim 39 words
The device of claim 1 further comprising a PMOS device in association with the NMOS device wherein said field oxide region comprises at least the spacing between said devices; and connections to the sources and drains of the devices.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-02-04 1994-08-06 1995-02-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-02-04 1998-08-06 1999-02-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-02-04 2002-08-06 2003-02-05 $7700.00 Window Closed / Lapsed

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