Semiconductor device having resistor structure

Claim 2

A semiconductor device comprising: a semiconductor substrate having a major surface; a field insulating layer selectively formed on said substrate and having a uniform bottom contacted to said substrate where any circuit element is free therefrom, said field insulating layer having a thickness ranging from 1.3 μm to 3.0 μm; an island-like portion of said major surfaces of said substrate protruded from said uniform bottom of said field insulating layer, surrounded completely by said field insulating layer, and having a rectangular plan shape where by circuit element is free therefrom; an insulating film covering and attached to said island-like portion of said major surface of said substrate, entirely, said insulating film having a uniform thickness ranging from 0.05 μm to 0.8 μm so that said insulating film is thinner than the thickness of said field insulating layer; a resistor element formed on and attached to said insulating film only above said island-like protruded portion of said major surface of said substrate such that any part of said resistor element is not deposited on said field insulating layer and that all parts of said resistor element are isolated from said major surface of said substrate by said insulating film; and a pair of wiring layers connected to a pair of end parts, respectively, of said resistor element above said island-like portion of said major surface of said substrate and extending above said field insulating layer.

Claim 3

A semiconductor device comprising: a semiconductor substrate having an island-like protruded portion where any circuit element is free therefrom and a depressed portion where any circuit element is free therefrom, said depressed portion surrounding said island-like protruded portion, said island-like protruded portion having an upper surface, a field insulating layer having an upper surface, formed on said depressed portion of said substrate and surrounding completely and island-like protruded portion of said substrate, said upper surface of said island-like protruded portion of said substrate and said upper surface of said field insulating layer being continuously provided and being substantially coplanar with each other, a first insulating film having a uniform thickness thinner than the thickness of said field insulating layer and contacted to all parts of said upper surface of said island-like protruded portion of said substrate and to said upper surface of said field insulating layer continuously, a resistor element formed on and attached to said first insulating film only above said island-like protruded portion of said substrate such that any part of said resistor element is free from above said field insulating layer and that all parts of said resistor element are isolated from said upper surface of said island-like protruded portion of said substrate by said first insulating film, and a wiring layer connected to said resistor element and extending above said field insulating layer, said island-like protruded portion of said substrate being provided for only installing said resistor element thereabove, whereby the heat produced in said resistor element during operation is effectively dispersed through said first insulating film into said island-like protruded portion of said substrate.

Claim 4

A semiconductor device comprising: a semiconductor substrate having an island-like protruded portion where any circuit element is free therefrom and a depressed portion where any circuit element is free therefrom, said depressed portion surrounding said island-like protruded portion, said island-like protruded portion having an upper surface, a field insulating layer having an upper surface, formed on said depressed portion of said substrate and surrounding completely and island-like protruded portion of said substrate, said upper surface of said island-like protruded portion of said substrate and said upper surface of said field insulating layer being continuously provided and being substantially coplanar with each other, a first insulating film having a uniform thickness thinner than the thickness of said field insulating layer and contacted to all parts of said upper surface of said island-like protruded portion of said substrate and to said upper surface of said field insulating layer continuously, a resistor element formed on and attached to said first insulating film only above said island-like protruded portion of said substrate such that any part of said resistor element is free from above said field insulating layer and that all parts of said resistor element are isolated from said upper surface of said island-like protruded portion of said substrate by said first insulating film, and a wiring layer connected to said resistor element and extending above said field insulating layer, said island-like protruded portion of said substrate being provided for only installing said resistor element thereabove, whereby the heat produced in said resistor element during operation is effectively dispersed through said first insulating film into said island-like protruded portion of said substrate.

Claim 5

The semiconductor device as claimed in claim 2 further comprising: a second insulating film having a thickness thinner than said thickness of said field insulating layer and provided on said resistor element and between said first insulating film and said wiring layer, and a contact hole provided in said second insulating film and reaching a part of the upper surface of said resistor element through which said wiring layer is connected to said part of said resistor element.

Claim 6

The semiconductor device as claimed in claim 3 wherein the thickness of said first insulating film ranges from 0.05 μm to 0.8 μm, and the total thickness of said first and second insulating films and said field insulating layer ranges from 1.3 μm to 3.0 μm.

Claim 7

The semiconductor device as claimed in claim 1 wherein said resistor element is made of polycrystalline silicon.

Claim 8

The semiconductor device as claimed in claim 2 wherein said wiring layer is made of metal.