Self-aligned heterojunction transistor

Claim 2

A semiconductor intermediate manufacturing product structure comprising: a monocrystalline body having first, second and third parallel layers of wider, narrower and wider band gaps, respectively, each of said first, second and third parallel layers including therein a doped region; said doped regions of said first, second and third regions having substantially the same cross-sectional area and being aligned to form a vertically aligned portion through said structure; said first, second and third regions being doped such that said first and third regions are of a first conductivity type and said second region is of a second, conductivity type; the portion of each said wider band gap layer outside of said aligned region being doped for high resisistivity, and the portion of said narrower band gap layer outside said aligned region being doped for high conductivity.

Claim 3

The structure of claim 1 wherein said doping outside said aligned region is produced by a single dopant element capable of determining a low conductivity in said wider band gap semiconductor material and capable of determining a high conductivity in said narrower band gap semiconductor material.

Claim 4

The structure of claim 1 wherein said first and said third layers are GaAs and said second layer is Ge.

Claim 5

The structure of claim 3 wherein said dopant is an element taken from the group of boron, aluminum, gallium and proton (hydrogen).

Claim 6

The structure of claim 2 wherein said first and said third layers are GaAs and said second layer is Ge.

Claim 7

The structure of claim 5 wherein said dopant is an element taken from the group of boron, aluminum, gallium and proton (hydrogen).

Claim 8

A heterojunction bipolar transistor comprising: a monocrystalline body having first, second and third parallel layers of wider, narrower and wider band gaps respectively, each of said first, second and third parallel layers including therein a doped region; said doped regions of said first, second and third regions having substantially the same cross-sectional area and being aligned to form a vertically aligned portion through said structure; said first, second and third regions being doped such that said first and third regions are of a first conductivity type and said second region is of a second, conductivity type; the portion of said body outside said aligned portion defining, in said first and third layers, a region of high resistivity, and in said second layer a region of high conductivity, at least one ohmic contact to the portion of said second layer in said portion outside said aligned portion separated from said aligned portion by a portion of said first layer, an ohmic contact to said first layer in said aligned portion, and an ohmic contact to said third layer.

Claim 9

A heterojunction bipolar transistor comprising: a monocrystalline body having first, second and third parallel layers of wider, narrower and wider band gaps respectively, each of said first, second and third parallel layers including therein a doped region; said doped regions of said first, second and third regions having substantially the same cross-sectional area and being aligned to form a vertically aligned portion through said structure; said first, second and third regions being doped such that said first and third regions are of a first conductivity type and said second region is of a second, conductivity type; the portion of said body outside said aligned portion defining, in said first and third layers, a region of high resistivity, and in said second layer a region of high conductivity, at least one ohmic contact to the portion of said second layer in said portion outside said aligned portion separated from said aligned portion by a portion of said first layer, an ohmic contact to said first layer in said aligned portion, and an ohmic contact to said third layer.

Claim 10

The transistor of claim 7 wherein a single impurity element provides, in the region outside the aligned region, high resistivity in said first and third layers and high conductivity in said second layer.

Claim 11

The transistor of claim 7 wherein said first and third layers are GaAs and said second layer is Ge.

Claim 12

The transistor of claim 9 wherein a single impurity element provides in the region outside the aligned region, high resistivity in said first and third layers and high conductivity in said second layer.

Claim 13

The transistor of claim 10 wherein said impurity element is taken from the group of boron, aluminum, gallium and proton (hydrogen).