US4860443A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for connecting leadless chip package
Assignee: Raytheon Co
•
Filing: 1988-03-23
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Granted: 1989-08-29
•
Expires: 2008-03-23
Abstract
Abstract Leadless chip package is adhesively secured to printed wiring board and is electrically connected by metallic conductor ribbon or wire to pads on the package and pads on the printed wiring board to provide secure connected without risk of solder bridging on high density leadless chip packages.
Inventors
- 👤 Philip V. Pesavento
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:37
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/303; H05K3/305; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2203/00; H05K2203/04; H05K2203/049; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
175 words
The method for mounting and connecting a hermetically sealed leadless chip package with connection pads selected from the group consisting of gold and gold-plated copper on the top face thereof on a printed wiring board, comprising the steps of: positioning the hermetically sealed leadless chip package on the printed circuit board and attaching it thereto adjacent pads selected from the group consisting of gold and gold-plated copper on the exposed top face of the printed wiring board and orienting the leadless chip package so that the pads on the top face thereof are directed in the same direction as the pads on the exposed top face of the printed wiring board; selecting a conductor from the group consisting of gold and gold-plated copper; and attaching the electrical conductor to an upwardly facing pad on the chip carrier and to an adacent upwardly facing pad on the printed wiring board by means of an attachment step selected from the group of attachment steps consisting of: ultrasonic welding, thermocompression bonding, ball bonding, wedge bonding and thermalsonic bonding.
Claim 2
Independent Claim
175 words
The method for mounting and connecting a hermetically sealed leadless chip package with connection pads selected from the group consisting of gold and gold-plated copper on the top face thereof on a printed wiring board, comprising the steps of: positioning the hermetically sealed leadless chip package on the printed circuit board and attaching it thereto adjacent pads selected from the group consisting of gold and gold-plated copper on the exposed top face of the printed wiring board and orienting the leadless chip package so that the pads on the top face thereof are directed in the same direction as the pads on the exposed top face of the printed wiring board; selecting a conductor from the group consisting of gold and gold-plated copper; and attaching the electrical conductor to an upwardly facing pad on the chip carrier and to an adacent upwardly facing pad on the printed wiring board by means of an attachment step selected from the group of attachment steps consisting of: ultrasonic welding, thermocompression bonding, ball bonding, wedge bonding and thermalsonic bonding.
Claim 3
Dependent Claim
29 words
The method of claim 1 including the step of: selecting the printed wiring board to be a fiber reinforced thermosetting adhesive printed wiring board, prior to the attachment step.
Claim 4
Dependent Claim
28 words
The method of claim 2 including the step of: selecting the conductor from the group consisting of conductors having a cross-section which is round, rectangular, triangular and oval.
Claim 5
Dependent Claim
28 words
The method of claim 1 including the step of: selecting the conductor from the group consisting of conductors having a cross-section which is round, rectangular, triangular and oval.
Claim 6
Dependent Claim
26 words
The method of claim 1 including the step of: securing the chip carrier package to the top face of the printed wiring board by adhesive attachment.
Claim 7
Dependent Claim
30 words
The method of claim 5 wherein the step of securing the hermetically sealed leadless chip carrier package to the top face of the printed wiring board is by adhesive securement.
Claim 8
Dependent Claim
27 words
The method of claim 5 wherein the step of securing the chip carrier package to the top face of the printed wiring board is by adhesive securement.
Claim 9
Dependent Claim
9 words
The article produced by the method of claim 7.
Claim 10
Dependent Claim
34 words
The method of claim 1 including a step of cleaning the printed wiring board and the leadless chip package is performed before the step of electrically interconnecting the pads by attachment of conductors therebetween.
Claim 11
Dependent Claim
70 words
The method of claim 1 including the step of: extending pads from the bottom to the top of the hermetically sealed leadless chip package and the extending step is performed before the positioning step so that there are pads on the hermetically sealed leadless chip carrier package facing both the top face of the printed wiring board and facing in the same direction as pads on the printed wiring board.
Claim 12
Dependent Claim
9 words
The article produced by the method of claim 1.
Claim 13
Independent Claim
212 words
The method of connecting a hermetically sealed leadless chip package on a printed wiring board comprising the steps of: printing wiring on a fiber reinforced thermosetting synthetic material board with conductive connection pads on a top face thereof; forming a hermetically sealed leadless chip package so that the chip package has conductive connection pads on a top surface thereof positioned adjacent to an edge of a surface opposite a bottom surface thereof; positioning the hermetically sealed leadless chip package with its bottom surface on the top face of the printed wiring board so that the connection pads on the hermetically sealed leadless chip package face in the same direction as the connection pads on the printed wiring board; adhesively securing the hermetically sealed leadless chip package in place with its bottom surface on the top face of the printed wiring board; bonding a metallic conductor to a connection pad on the hermetically sealed leadless chip package and bonding the same metallic conductor to a corresponding connection pad on the printed wiring board; and repeating the bonding steps for a plurality of connection pads on the hermetically sealed leadless chip package so that the circuitry of the hermetically sealed leadless chip package is connected to the connection pads on the printed wiring board.
Claim 14
Independent Claim
212 words
The method of connecting a hermetically sealed leadless chip package on a printed wiring board comprising the steps of: printing wiring on a fiber reinforced thermosetting synthetic material board with conductive connection pads on a top face thereof; forming a hermetically sealed leadless chip package so that the chip package has conductive connection pads on a top surface thereof positioned adjacent to an edge of a surface opposite a bottom surface thereof; positioning the hermetically sealed leadless chip package with its bottom surface on the top face of the printed wiring board so that the connection pads on the hermetically sealed leadless chip package face in the same direction as the connection pads on the printed wiring board; adhesively securing the hermetically sealed leadless chip package in place with its bottom surface on the top face of the printed wiring board; bonding a metallic conductor to a connection pad on the hermetically sealed leadless chip package and bonding the same metallic conductor to a corresponding connection pad on the printed wiring board; and repeating the bonding steps for a plurality of connection pads on the hermetically sealed leadless chip package so that the circuitry of the hermetically sealed leadless chip package is connected to the connection pads on the printed wiring board.
Claim 15
Dependent Claim
30 words
The method of claim 12 wherein the bonding step is selected from the group of bonding steps consisting of: ultrasonic welding, thermocompression bonding, ball bonding wedge bonding and thermalsonic bonding.
Claim 16
Dependent Claim
29 words
The method of claim 12 wherein the bonding of an electrical conductor is performed with a metallic wire selected from the group consisting of gold and gold plated copper.
Claim 17
Dependent Claim
45 words
The method of claim 12 wherein the step of forming the pads on the hermetically sealed leadless chip package includes the step of forming the pads so that they are present on both the top and bottom surfaces of the hermetically sealed leadless chip package.
Claim 18
Dependent Claim
9 words
The article produced by the method of claim 15.
Claim 19
Dependent Claim
9 words
The article produced by the method of claim 12.
References Cited (Backward Citations)
US3235945A
Cited
US3471753A
Cited
US3554821A
Cited
GB1252883A
Cited
US3793064A
Cited
US3833838A
Cited
US4372037A
Cited
US4294009A
Cited
US4225900A
Cited
US4423468A
Cited
US4437141A
Cited
JPS5848442A
Cited
US4447857A
Cited
US4567643A
Cited
US4631820A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-28 | 1993-02-27 | 1993-08-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-28 | 1997-02-27 | 1997-08-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-28 | 2001-02-27 | 2001-08-29 | $7700.00 | Window Closed / Lapsed |