Patent US4851966A successfully refreshed from Google Patents.
US4851966A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus of printed circuit board assembly with optimal placement of components
Assignee: Motorola Solutions Inc
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Filing: 1986-11-10
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Granted: 1989-07-25
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Expires: 2006-11-10
Abstract
Abstract Method and apparatus are disclosed for printed circuit board assembly wherein optimal placement of components are effected. Components, such as microminiature components, are placed, at least on the underside of the circuit board, whereby specially contoured solder pads effect a self-alignment of such components prior to their being affixed in place by a suitable adhesive material.
Inventors
- 👤 Kenneth J. Roback
- 👤 Thomas R. Beise
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/341; H05K3/3421; H05K3/3431; H05K3/3442; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09381; H05K2201/094; H05K2201/09654; H05K2201/09663; H05K2201/10; H05K2201/10007; H05K2201/10166; H05K2201/10431; H05K2201/10583; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10689; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/048; H05K3/303; H05K3/305; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
155 words
A high density printed circuit board assembly having an arrangement of components thereon, including surface mounted microminiature components optimally located on respective sides of the circuit board, comprising; a circuit board having a conductive pattern on both sides thereof for accommodating the associated components thereon, including soldering pads of a particularized shape at least on the under side of the circuit board that provide a self-alignment action for those surface mounted components placed thereon; said soldering pads comprising a shaped base layer of conductive plating on which a contoured dome of solder is captivated to provide a three dimensional configuration, each of said soldering pads being precision located on said printed circuit board; said printed circuit board having surface mounted microminiature components machine placed at least on the underside thereof, self-aligned both longitudinally and laterally by said particular shaped soldering pads and affixed to the circuit board by adhesive prior to soldering the assembled board.
Claim 2
Dependent Claim
155 words
A high density printed circuit board assembly having an arrangement of components thereon, including surface mounted microminiature components optimally located on respective sides of the circuit board, comprising; a circuit board having a conductive pattern on both sides thereof for accommodating the associated components thereon, including soldering pads of a particularized shape at least on the under side of the circuit board that provide a self-alignment action for those surface mounted components placed thereon; said soldering pads comprising a shaped base layer of conductive plating on which a contoured dome of solder is captivated to provide a three dimensional configuration, each of said soldering pads being precision located on said printed circuit board; said printed circuit board having surface mounted microminiature components machine placed at least on the underside thereof, self-aligned both longitudinally and laterally by said particular shaped soldering pads and affixed to the circuit board by adhesive prior to soldering the assembled board.
Claim 3
Dependent Claim
21 words
A printed circuit board assembly in accordance with claim 1, wherein said contoured soldering pads are formed in a horse-shoe configuration.
Claim 4
Dependent Claim
17 words
A printed circuit board assembly in accordance with claim 1, wherein said contoured soldering pads are L-shaped.
Claim 5
Dependent Claim
16 words
A printed circuit board assembly in accordance with claim 1, wherein said conductive plating is copper.
Claim 6
Dependent Claim
28 words
A printed circuit board assembly in accordance with claim 1, wherein said microminiature components that may be accommodated include at least diodes, capacitors, resistors and small outlying components.
Claim 7
Dependent Claim
33 words
A printed circuit board assembly in accordance with claim 1, wherein said components that may be accommodated further include any surface mount components not requiring thru holes on the associated printed circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |