US3770874A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Contact members for soldering electrical components
Assignee: Siemens AG
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Filing: 1971-09-07
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Granted: 1973-11-06
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Expires: 1991-09-07
Abstract
Abstract Contact members for soldering components to a circuit means or wiring boards, wherein the components include semiconductors, integrated or hybrid circuits such as flip-chip circuit for assembly by reflow-solder methods. A contact member comprises at least two equal geometric areas interconnected by a narrow bridge. In preferred embodiments the contact members are composed of a base gold layer overcoated with a nickel layer.
Inventors
- 👤 F Krieger
- 👤 O Wirbser
- 👤 A Pfeiffer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 06:20
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/04; H05K2203/042; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/231; H10W72/232; H10W72/29; H10W72/90; H10W72/931; H10W72/932; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
25 words
A contact member as defined in claim 1 wherein the geometric areas and the bridge area are composed of a metal having good electrical conductivity.
Claim 2
Dependent Claim
47 words
A contact member as defined in claim 1 wherein the geometric areas and the bridge area are comprised of a base layer of a relatively inert, electrically conductive metal and a superimposed layer of another electrically conductive metal characterized by resistance to interaction with tin-containing solder materials.
Claim 3
Dependent Claim
22 words
A contact member as defined in claim 3 wherein the base layer is of gold and the superimposed layer is of nickel.
Claim 4
Dependent Claim
172 words
A contact member for reflow soldering of an electrical component as to flip-chip circuits, hybrid circuits or wiring boards comprising at least two conductive substantially equal square-like areas spaced apart from one another on a non-conductive substrate and supported thereby, said areas being composed of a base layer of gold in direct contact with non-conductive substrate and a superimposed layer of nickel in direct contact with said base layer; a layer of solder of a given thickness on each of said square-like areas; a conductive bridge of a width smaller than one of said square-like areas and sufficiently wide for solder flow from one of said square-like areas to another, said bridge being positioned on said non-conductive substrate to connect said square-like areas with one another, said bridge being composed of a base layer of gold in direct contact with said non-conductive substrate and a superimposed layer of nickel in direct contact with said base layer; and a layer of solder of a thickness less than said given thickness on said bridge.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-05 | 1977-05-07 | 1977-11-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-05 | 1981-05-07 | 1981-11-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-05 | 1985-05-07 | 1985-11-06 | $7700.00 | Window Closed / Lapsed |