Patent US4833567A successfully refreshed from Google Patents.
US4833567A
Expired / Lapsed
US
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Integral heat pipe module
Assignee: Hewlett Packard Development Co LP
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Filing: 1987-10-09
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Granted: 1989-05-23
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Expires: 2007-10-09
Abstract
Abstract An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface. The latent heat of vaporization is removed from the vapor so it recondenses and returns to the bottom of the module to repeat the heat transfer cycle. The wick's capillary pumping action keeps the fluid distributed over the top surface of the electronic component. The grooved top surface of the electronic component exposed to the wick cause an inverted liquid meniscus to be formed over the component. This causes the liquid adjacent the top of the component to readily evaporate.
Inventors
- 👤 Elric Saaski
- 👤 Robert J. Hannemann
- 👤 Leslie R. Fox
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 09:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; F28D15/04; F28D15/046; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
197 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap having a surface spaced a selected distance away from the top surface of the electrical component so a continuous thin film of liquid is maintained therebetween, said condenser cap having a plurality of flued sections that extend upward from said surface across the condenser cap; and c. a sufficient volume of a two-phase, noncorrosive dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so as to maintain a thin film of liquid working fluid that extends continuously between the top surface of the electronic component and said condenser surface; said fluted sections of said cap being substantially free of said liquid fraction of working fluid, so that heat transfer by said working fluid from the component is substantially by thin film evaporation.
Claim 2
Dependent Claim
197 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap having a surface spaced a selected distance away from the top surface of the electrical component so a continuous thin film of liquid is maintained therebetween, said condenser cap having a plurality of flued sections that extend upward from said surface across the condenser cap; and c. a sufficient volume of a two-phase, noncorrosive dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so as to maintain a thin film of liquid working fluid that extends continuously between the top surface of the electronic component and said condenser surface; said fluted sections of said cap being substantially free of said liquid fraction of working fluid, so that heat transfer by said working fluid from the component is substantially by thin film evaporation.
Claim 3
Dependent Claim
33 words
The integral heat pipe module of claim 1 wherein the flues are separated by vertical side walls, and the bottom of the side walls forming said condenser surface spaced from the electronic component.
Claim 4
Dependent Claim
20 words
The integral heat pipe module of claim 1 wherein each of the flutes has a top section with semicircular cross-section.
Claim 5
Dependent Claim
20 words
The integral heat pipe module of claim 1 wherein the flutes are connected together by at least one cross flute.
Claim 6
Dependent Claim
17 words
The integral heat pipe of claim 1 wherein the condenser cap is connected to a heat sink.
Claim 7
Dependent Claim
28 words
The integral heat pipe of claim 5 wherein thcondenser cap is provided with at least one external cooling fin, whereby said cooling fin serves as a heat sink.
Claim 8
Dependent Claim
29 words
The integral heat pipe of claim 5 wherein the condensor cap is connected to a heat sink by securing a cold plate to the top of the condensor cap.
Claim 9
Dependent Claim
196 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, so as to define a space therebetween, said surface having a plurality of fluted sections that extend across the condenser surface; c. a porous wick of sufficient thickness in said chamber between the top of the electrical component and said condenser surface so as to substantially fill the space therebetween; and d. a sufficient volume of a two-phase, noncorrosive, dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so said porous wick is saturated with the liquid fraction of working fluid so as to maintain a thin film of liquid working fluid within said porous wick that extends continuously between the top surface of the electronic component and the condenser surface.
Claim 10
Dependent Claim
196 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, so as to define a space therebetween, said surface having a plurality of fluted sections that extend across the condenser surface; c. a porous wick of sufficient thickness in said chamber between the top of the electrical component and said condenser surface so as to substantially fill the space therebetween; and d. a sufficient volume of a two-phase, noncorrosive, dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so said porous wick is saturated with the liquid fraction of working fluid so as to maintain a thin film of liquid working fluid within said porous wick that extends continuously between the top surface of the electronic component and the condenser surface.
Claim 11
Dependent Claim
33 words
The integral heat pipe module of claim 8 wherein the flutes are separated by vertical side walls, and the bottom of the side walls form the condenser surface spaced from the electronic component.
Claim 12
Dependent Claim
20 words
The integral heat pipe module of claim 8 wherein each of the flutes has a top section with semicircular cross-section.
Claim 13
Dependent Claim
20 words
The integral heat pipe module of claim 8 wherein the flutes are connected together by at least one cross flute.
Claim 14
Dependent Claim
39 words
The integral heat pipe of claim 8 wherein an evaporator cap having a grooved top surface is attached to the top of the electronic component, and the top of said grooved top surface is in contact with said wick.
Claim 15
Dependent Claim
17 words
The integral heat pipe of claim 8 wherein the condenser cap is connected to a heat sink.
Claim 16
Dependent Claim
29 words
The integral heat pipe of claim 13 wherein the condenser cap is provided with at least one external cooling fin, whereby said cooling fin serves as a heat sink.
Claim 17
Dependent Claim
29 words
The integral heat pipe of claim 13 wherein the condenser cap is connected to a heat sink by securing a cold plate to the top of the condenser cap.
Claim 18
Dependent Claim
18 words
The internal heat pipe of claim 8 wherein the wick is composed of multiple layers of fibrous material.
Claim 19
Dependent Claim
20 words
The integral heat pipe of claim 8 wherein the wick is formed of a plurality of layers of polyester cloth.
Claim 20
Dependent Claim
38 words
The integral heat pipe of claim 16 wherein the wick is composed of woven fibrouus material and the layer in contact with the electronic component has a greater mesh than the layers spaced away from the electronic component.
Claim 21
Dependent Claim
40 words
The integral heat pipe of claim 16 wherein the wick is composed of woven fibrous material and the layer in contact with the condenser surface flutes has a coarse mesh than the layers spaced away from the condenser surface flutes.
Claim 22
Dependent Claim
23 words
The integral heat pipe of claim 8 wherein the electronic component is provided with a grooved top surface in contact with the wick.
Claim 23
Dependent Claim
22 words
The integral heat pipe of claim 12 wherein the electronic component and the evaporator cap are formed of essentially the same material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-22 | 1992-11-21 | 1993-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-22 | 1996-11-21 | 1997-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-22 | 2000-11-21 | 2001-05-23 | $7700.00 | Window Closed / Lapsed |