US4047198A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Transistor cooling by heat pipes having a wick of dielectric powder
Assignee: Raytheon Co
•
Filing: 1976-04-19
•
Granted: 1977-09-06
•
Expires: 1996-04-19
Abstract
Abstract A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.
Inventors
- 👤 Kalwant S. Sekhon
- 👤 Lloyd A. Nelson
- 👤 John E. Fritz, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:35
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; H10W40/73; F28F; F28F2200/00; F28F2200/005; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49227; Y10T29/4935; Y10T29/49353
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
162 words
A microelectronic package capable of operating with power densities extending at least to 10 kW/cm 2 comprising: means for defining a sealed enclosure coupled to an external heat sink; means for defining electronic devices and circuitry sealed within said enclosure means; electrical coupling means from said electronic devices and circuitry means and extending outside of said enclosure means for electrically coupling said electronic devices and circuitry means to further electronic circuits; means including dielectric powder adhered substantially to all interior surfaces of said enclosure means and to all exposed surfaces of said electronic devices and circuitry means for defining a heat pipe wick substantially completely and conformally coating said interior and exposed surfaces; and means for defining a dielectric working fluid in said enclosure means and intimately contactable with all said interior and exposed surfaces, thereby for minimizing the occurrence of local hot spots on said electric devices and circuitry means and for maximizing heat transfer therefrom to said external heat sink.
Claim 2
Dependent Claim
162 words
A microelectronic package capable of operating with power densities extending at least to 10 kW/cm 2 comprising: means for defining a sealed enclosure coupled to an external heat sink; means for defining electronic devices and circuitry sealed within said enclosure means; electrical coupling means from said electronic devices and circuitry means and extending outside of said enclosure means for electrically coupling said electronic devices and circuitry means to further electronic circuits; means including dielectric powder adhered substantially to all interior surfaces of said enclosure means and to all exposed surfaces of said electronic devices and circuitry means for defining a heat pipe wick substantially completely and conformally coating said interior and exposed surfaces; and means for defining a dielectric working fluid in said enclosure means and intimately contactable with all said interior and exposed surfaces, thereby for minimizing the occurrence of local hot spots on said electric devices and circuitry means and for maximizing heat transfer therefrom to said external heat sink.
Claim 3
Dependent Claim
21 words
A microelectronic package as in claim 1 wherein said dielectric powder is selected from the group consisting of chopped glass fibers.
Claim 4
Dependent Claim
22 words
A microelectronic package as in claim 2 wherein said working fluid means is selected from the group consisting of the fluoro chemicals.
Claim 5
Dependent Claim
30 words
A microelectronic package as in claim 2 wherein said dielectric powder means has a size of approximately 0.01 to 0.05 inches in length and 0.0002 to 0.0004 inches in diameter.
Claim 6
Dependent Claim
35 words
A microelectronic package as in claim 1 wherein said heat pipe wick means comprises a configuration defined by a spray of said dielectric powder deposited onto an adhesive applied to said interior and exposed surfaces.
Claim 7
Dependent Claim
28 words
A microelectronic package as in claim 5 wherein said configuration is further defined by the inclusion of said working fluid with said dielectric powder means in said spray.
Claim 8
Dependent Claim
35 words
A microelectronic package as in claim 1 wherein said heat pipe wick means comprises a configuration defined by a spray of both said dielectric powder and an adhesive deposited onto said interior and exposed surfaces.
Claim 9
Dependent Claim
28 words
A microelectronic package as in claim 7 wherein said configuration is further defined by the inclusion of said working fluid with said dielectric powder means in said spray.
References Cited (Backward Citations)
US3673306A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-09-05 | 1981-03-07 | 1981-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-09-05 | 1985-03-07 | 1985-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-09-05 | 1989-03-07 | 1989-09-06 | $7700.00 | Window Closed / Lapsed |